Andy Shaughnessy speaks with Jeremie Waller, senior electrical engineer at Quantel USA, about the panel he’ll be participating in during AltiumLive 2020 on design with manufacturing. He and panelists Gerry Partida of Summit Interconnect and Greg Zhiraldo of Advanced Assembly will discuss why designers need to see their fabrication and assembly providers as true partners, not just customers, and why communication is such a vital part of the design process.
Visit Real Time with… AltiumLive 2020 to catch the latest video interviews and event-related content.
Share
Suggested Items
DownStream Flexes in Rigid-Flex
11/14/2022 |
Andy Shaughnessy, Design007 Magazine
During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.
Sunstone’s Matt Stevenson Shares Insights From New PCB Design Book
10/27/2022 |
Nolan Johnson, I-Connect007
There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.
Forming Standards for Ultra HDI
10/25/2022 |
Andy Shaughnessy, Design007 Magazine
To get the latest news about ultra high-density interconnections (UHDI), we checked in with Jan Pedersen, NCAB Group’s director of technology. Jan is co-chair of IPC D-33AP, and a great source of overall DFM expertise as well. We asked him to give us a snapshot of UHDI in the industry, where we’re headed, and what this means to PCB designers.
