PCB East 2021: Call for Abstracts

Reading time ( words)

In response to customer demand, PCB East returns to Boston for 2021 for the first time since 2009.

The three-day technical conference takes place May 10-12, 2021, in Marlborough, MA. The event includes a one-day exhibition on May 11.

“PCB East is a much-needed opportunity for the design community to get together and check out the latest technology,” said Mike Buetow, editor in chief, PCD&F/CIRCUITS ASSEMBLY and conference director, PCB East. “The show is expected to include a range of suppliers from the ECAD, PCB design service, fabrication and assembly supply chain. As Covid-19 has slowed national travel, locally-focused events like PCB East have become vital networking and selling opportunities.” 

UP Media Group seeks abstracts for the event, which will include presentations of two, 3.5 and seven hours. 

Suggested paper and presentation topics include: 

Design

• RF and microwave design 
• Signal integrity 
• High-speed, high-frequency design
• Flex circuit design 
• Component placement 
• EMI/EMC analysis 
• Thermal analysis and management 
• HDI design 
• PCB design/layout basics 
• Component library creation and management 
• Design for manufacture/DfM/DfA/DfT/DfX 
• Packaging design 
• Mixed-signal design 
• Area arrays 
• FPGA design and implementation 
• Design team collaboration 

Fabrication

• PCB fabrication 
• Flexible circuit manufacturing 
• HDI 
• Surface finishes 
• Embedded passives and active devices 

Assembly 

• Electronics assembly 
• New component packaging 
• Screen and stencil printing 
• Component placement 
• Soldering and materials 
• Test and inspection

Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology. 

Abstracts of 100 to 500 words and speaker biographies should be submitted to UP Media Group by December 11, 2020. 

Anyone may submit an abstract to present a course at PCB East 2021, and presenters may present more than one paper or teach more than one course. A separate abstract must be submitted for each course. 

If selected, a detailed presentation outline and final paper or presentation is due April 2, 2021. Selected presenters receive access to the entire technical conference and the proceedings.

04/05/2023 | Nolan Johnson, I-Connect007

Hot on the heels of the news that U.S. President Biden signed a presidential determination in support of the printed circuit board industry, I-Connect007’s Nolan Johnson spoke with David Schild, executive director of the Printed Circuit Board Association of America, about some of the expected implications. David points out, among other things, that this signals increased momentum with government and defense to support U.S.-based printed circuit manufacturing, and the possibility that a renewed interest in the industry by private financing could possibly follow.

04/04/2023 | Barry Matties, I-Connect007

The I-Connect007 team paid a visit to American Standard Circuits in West Chicago, Illinois. While there, we talked at length with CEO Anaya Vardya about the issues on his mind as he pushes technology, expands his floor space, and considers the implications of the CHIPS Act, staffing issues, and what’s happening in China.

03/29/2023 | Pete Starkey, I-Connect007

At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.