-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
PCB East 2021: Call for Abstracts
October 8, 2020 | UP Media GroupEstimated reading time: 1 minute
In response to customer demand, PCB East returns to Boston for 2021 for the first time since 2009.
The three-day technical conference takes place May 10-12, 2021, in Marlborough, MA. The event includes a one-day exhibition on May 11.
“PCB East is a much-needed opportunity for the design community to get together and check out the latest technology,” said Mike Buetow, editor in chief, PCD&F/CIRCUITS ASSEMBLY and conference director, PCB East. “The show is expected to include a range of suppliers from the ECAD, PCB design service, fabrication and assembly supply chain. As Covid-19 has slowed national travel, locally-focused events like PCB East have become vital networking and selling opportunities.”
UP Media Group seeks abstracts for the event, which will include presentations of two, 3.5 and seven hours.
Suggested paper and presentation topics include:
Design
- RF and microwave design
- Signal integrity
- High-speed, high-frequency design
- Flex circuit design
- Component placement
- EMI/EMC analysis
- Thermal analysis and management
- HDI design
- PCB design/layout basics
- Component library creation and management
- Design for manufacture/DfM/DfA/DfT/DfX
- Packaging design
- Mixed-signal design
- Area arrays
- FPGA design and implementation
- Design team collaboration
Fabrication
- PCB fabrication
- Flexible circuit manufacturing
- HDI
- Surface finishes
- Embedded passives and active devices
Assembly
- Electronics assembly
- New component packaging
- Screen and stencil printing
- Component placement
- Soldering and materials
- Test and inspection
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology.
Abstracts of 100 to 500 words and speaker biographies should be submitted to UP Media Group by December 11, 2020.
Anyone may submit an abstract to present a course at PCB East 2021, and presenters may present more than one paper or teach more than one course. A separate abstract must be submitted for each course.
If selected, a detailed presentation outline and final paper or presentation is due April 2, 2021. Selected presenters receive access to the entire technical conference and the proceedings.
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).