Andy Shaughnessy and Lawrence Romine, vice president of corporate marketing for Altium, discuss some of the lessons learned from the virtual U.S. AltiumLive, which took place October 6-8, as well as what attendees can expect from the European show, which takes place October 20–22, 2020.
I-Connect007 will also have coverage of the European AltiumLive event.
Visit Real Time with… AltiumLive 2020 to catch the latest video interviews and event-related content.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Nolan Johnson, I-Connect007
In this interview with Arjun Bangre, director of product for high-speed interface IPs for PCI Express and CXL at Rambus, the discussion revolves around new developments in CXL, PCI Express, and interoperable IP solutions that Rambus has developed.
Cherie Litson, CID+, Litson1 Consulting
With components getting smaller and electronic devices becoming more compact, we are reaching the physical limits of the typical etched fabrication processes. To address these limits, new additive and semi-additive processes are being developed to fit into the current fabricators’ production lines without too much disruption or extra cost.