MacDermid Alpha Releases MacuSpec VF-TH 300 V-Pitting Resistant Pattern Plating Metallization


Reading time ( words)

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.

As the 5G standard is growing outward from the highest tier smartphones, board manufacturers of these devices need to increase high density layers beyond the capability of regular HDI and into the realm of more difficult to build modified Semi Additive Processing (mSAP). The MacuSpec VF-TH 300 is a single step pattern plating process for the simultaneous copper filling of blind microvias and plating of through holes while providing controlled trace profiles in mSAP applications. The innovative process deposits an electrolytic copper layer that is naturally resistant to a phenomenon called V-pitting which can occur during the final etching process. V-Pits are a reliability concern that are currently addressed with an annealing process that involves baking the boards after plating for several hours. With the VF-TH 300, customers can now utilize a shortened bake or skip the bake entirely and achieve V-pit free results, improving quality and increasing production throughputs. The process does not require a predip or flash plate and is completely analyzable by CVS for ease of process control.

MacuSpec VF-TH 300 can be plated directly onto low etch direct metallization technologies like Blackhole LE and Eclipse LE. This leverages improvements in copper etch budget and elimination of palladium activation, electroless copper, and flash plating, while increasing quality and reducing costs. When these innovations are combined with the soon-to-be released CircuEtch 200, a high-performance anisotropic final etch, the result is mSAP with higher yields and ease of manufacturing for the next generation of smartphones and other mobile devices.

“We are constantly innovating to address manufacturing challenges and provide solutions that enable our customers to achieve the previously impossible in challenging areas like mSAP. The release of MacuSpec VF-TH 300 allows a cost down approach to the reliability concerns associated with V-pitting that does not require trade-offs to achieve a higher quality board. We are intensely focused on the expanding needs of the mobile market with the growth of 5G smartphones, and the complex mainboards that are requiring technologies like ours to provide stable and high yield manufacturing.” – Rich Bellemare, Director of Electrolytic Metallization, Circuitry Solutions.

For more information on MacuSpec VF-TH 300, please visit MacDermidAlpha.com

About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

 

Share

Print


Suggested Items

EIPC Technical Snapshot: Automotive Technology

10/19/2020 | Pete Starkey, I-Connect007
Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

10/16/2020 | Nolan Johnson, I-Connect007
Trade shows and technical conferences haven’t died; they’ve just moved online. The trade show season continues in virtual full force this week, and event coverage dominates the top five this week. Surprisingly, I don’t see events as this week’s theme. No, this week’s theme is “pundits.” We have Walt Custer’s industry outlook, seven experts on additive electronics, a designers conference keynote, and the IPC’s government relations expert. Don’t get me wrong: These folks are asked to speak to the industry for a good reason. They know their subject matter, and they present it skillfully. This week’s top five picks are worth reading.

Just Ask John Mitchell: The Exclusive Compilation

10/05/2020 | I-Connect007 Editorial Team
We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”



Copyright © 2020 I-Connect007. All rights reserved.