Reading time ( words)
EIPC will hold a webinar at which three very reassuring gentlemen will help matters become a little clearer.
In the 45-minute session, moderated by our Chairman Alun Morgan, we will hear from;
Dr. SHIUH-KAO CHIANG, Prismark, who will show how the pandemic has substantially distorted PCB production patterns and demand expectations. He will reflect on the 2020 PCB market and discuss the various key factors that drive or alter the market momentum.
Prismark Abstract: 2020 is a year to remember. This is probably the first time that the global electronics and PCB industries are deeply impacted by an infectious disease. Furthermore, the pandemic has substantially distorted PCB production patterns and demand expectations. As a result, the 2020 PCB market is very different from originally anticipated. In this presentation, Prismark will present its views on the 2020 PCB market and discuss the various key factors that drive or alter the market momentum.
Mike Vinson, Averatek, will look at how the availability of thinner high-performance materials brings many advantages to board layout and design without affecting impedance requirements.
Averatek Abstract: The trace size on today’s high speed circuits are often limited by impedance matching and dielectric thickness. Semi-Additive PCB fabrication enabling smaller, more accurate traces with straighter more precise trace sidewalls in combination with the availability of thinner high-performance materials bring many advantages to board layout and design without affecting impedance requirements. This presentation will discuss the A-SAP™ process and its impact on signal integrity and PCB design.
Roland Herold, Atotech, will underline the importance of reliability when plating electrolytic stacked blind micro vias (BMVs), and give an overview about the latest findings & developments in electrolytic copper.
Atotech Abstract: The continuously increasing thermo-mechanic reliability requirements for e.g. automotive electronics and 5G hand-held PCBs needs a better understanding of all production processes.
Apart from the contribution of the well-known factors like base material properties, pressing/lamination & drilling conditions, de-smearing & deposition parameter of the conductive seed layer, the set-up of the electrolytic copper process plays an important role in advanced interface reliability between stacked micro-vias.
The webinar introduces into the gives an overview about the latest findings & developments in electrolytic copper.
There will be a Q&A session after the last speaker. Free for EIPC members and a charge for non-members.
