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The 15th Electronic Circuits World Convention (ECWC) is now open for registration. The 3-day ECWC15 conference will be hosted by the Hong Kong Printed Circuit Association from 30 Nov to 2 Dec 2020. The full conference will be conducted online with Day 3 of the conference being simultaneously held at the Shenzhen Convention & Exhibition Centre, China in conjunction with the “International Electronics Circuit Exhibition (Shenzhen)."
The ECWC15, the "Olympic Event of the PCB Industry", brings industry experts and professionals around the world to share the hottest topics, best practices and trends in the PCB and electronics manufacturing field. The conference includes oral and poster sessions, popular keynote sessions, engaging Q&A session and panel discussion.
Technical Program details include:
- 9 interesting keynote sessions
- 50 technical oral presentations in 3 tracks for 2 full days
- Engaging Q&A and panel discussion on the closing day
- 30 poster presentations including "Best Papers" which will be displayed at “International Electronics Circuit Exhibition (Shenzhen)”
Don’t miss the chance, join our conference to hear from the best! Enroll now. Please visit www.ecwc15.org to view the details of the program and register.
I-Connect007 Editorial Team
We recently spoke with longtime I-Connect007 columnist Michael Carano, vice president of quality at Averatek, about pricing strategies for PCB fabricators. We’re seeing some movement in this segment as fabricators, already dealing with some of the tightest profit margins around, find themselves having to either raise their prices or trying to massage more revenue out of their already streamlined processes. We asked Michael for some pricing strategies for fabricators, and he shared a range of options for today’s manufacturers who aren’t afraid to rethink their processes and try new ideas. And, as he says, people will still pay good money for a quality, reliable PCB.
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.