WHMA/IPC Calls for Participation for Electrical Wire Processing Technology Expo 2021


Reading time ( words)

WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 11-13, 2021 at the Wisconsin Center in Milwaukee, Wis.

Expert technical presentations are being sought in the following areas:

  • Case Studies on A-620 Success
  • Quality Requirements
  • ESD Impacts on Harness
  • ESD Transmission through Harnesses
  • High Frequency Cabling
  • X-ray Inspection Techniques
  • Crimping Challenges/Dos and Don’ts
  • Crimp Cross Sectioning
  • Wire Harness Troubleshooting
  • Reliability Issues and Failure Analysis
  • Wiring Harness Education and Training
  • Connector Advances
  • Tooling
  • Process Equipment/Productions
  • Calibration
  • Ultrasonics Splicing and Terminating
  • Harness Design Drawings
  • Engineering
  • Overmolding
  • Testing – Electrical/Environmental/
  • Mechanical
  • Electric Vehicles (EV)/Electric Mobility
  • Cleanliness and FOD
  • Wiring Harness Rework

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest, and contain appropriate technical test results. Final selected presentations will be limited to 30 minutes. Technical conference paper abstracts and course proposals are due January 5, 2021. To submit an abstract or course proposal, contact David Bergman, WHMA executive director and IPC vice president, standards and technology, at DavidBergman@ipc.org.

For additional information on attending or exhibiting, visit www.electricalwireshow.com.

 

Share

Print


Suggested Items

Happy Holden: ECWC15 Virtual Event a Success

12/15/2020 | Happy Holden, I-Connect007
This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/11/2020 | Nolan Johnson, I-Connect007
This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.

EIPC Technical Snapshot: Automotive Technology

10/19/2020 | Pete Starkey, I-Connect007
Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.



Copyright © 2021 I-Connect007. All rights reserved.