In this audio interview, Lee Ritchey shares a story about his favorite PCB design—a board that he built on his kitchen table early in his career for a radio used on the Apollo 11 spacecraft. Lee explains how he ended up working on this design as a young engineer, as well as the excitement that he felt watching Apollo 11 land on the moon while carrying his PCB. He also jokes about why his wife was less than pleased with his handiwork when he drilled holes in the board on the kitchen table.
To download this audio (mp3) file, click here.
Tomas Chester, Chester Electronic Design
Advances in technology have been clear to see within the component packaging industry, as the ball grid array (BGA) package sizes reduce from 1.0 mm pitch to 0.8 mm, 0.4 mm, and even beyond. However, while these improvements have occurred with component packages, it has become increasingly more difficult to break out and route the dense circuitry associated with these parts. Currently, the high-density interconnect (HDI) method typically used for the breakout of such parts has been to create the smallest possible subtractive-etched traces with microvias to allow for connections and escapes on the innerlayers of your PCB.
Andy Shaughnessy, I-Connect007
Harry Kennedy and Sarmad Khemmoro of Altair recently spoke with Andy Shaughnessy about their AltiumLive presentations, which are now available online. They discuss the need for modeling, simulation, and verification in PCB design, and why these actions should be performed as early in the design process as possible.
Celso Faia and Davi Correia, Cadence Design Systems
The Hubble telescope, the Cassini-Huygens mission, and other exploratory spacecraft utilize high-voltage DC power supplies for everything from vidicon camera tubes and mass spectrometers to radar and laser technologies. NASA has experienced performance problems with the 1.5 kV supplies because—as a 2006 report stated—“designers did not take the high-voltage problems seriously in the initial design.” The report cited very narrow parts parameters, electrical insulation problems in dielectrics, ceramics, bad geometries, small spacing, the use of the wrong insulating materials, and thermal expansion as causes for the power supply failures.