The dissipation of heat from electronic power modules is increasingly critical to maintain their functionality and increase their reliability. Insulated metal substrates (IMS) offer a proven route to thermal management, and this specialist technology is increasingly employed in multilayer stack-ups for power applications.
This Realtime with... I-Connect007 roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer. The benefits of technical and engineering support from a one-stop laminate supplier become clearly apparent.
To download the audio of this roundtable discussion (mp3) file to listen on the go, click here.
To download the PDF transcript booklet of this rountable, click here.
NASA has selected hundreds of small businesses and dozens of research institutions to develop technology to help drive the future of space exploration, ranging from novel sensors and electronics to new types of software and cutting-edge materials. The project, funded by NASA’s Small Business Technology Transfer program, could help improve the efficiency of solar cells for space missions and use on Earth.
UK Space Agency
British space technology will help pioneer new approaches to energy, communications and resources, thanks to new projects from the UK Space Agency.
Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.