I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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This week’s news gave off every indicator that we’ve started a new calendar year. The news channels were busy with changes in leadership—both corporate and governmental—and changes in ownership. Changes in representation, too. Honestly, it was hard to sort out the news to just five top items. Be that as it may, here are five things we think you ought to read, even if you read nothing else about the electronics manufacturing industry this week: tradeshow coverage, strategic acquisitions, market discussion, and governmental advocacy.

CES 2021 Coverage: A Virtual Show Floor
Published January 17

Our intrepid CES gumshoe reporter, Dan Feinberg, led our coverage of the virtual version of this year’s show. Dan’s CES coverage is always popular reading. This year, thanks to the virtual format, Happy Holden and Pete Starkey joined Dan and me, posting reports from CES. You’ll find full coverage in the upcoming issue of SMT007 Magazine. In the meantime, here is Dan’s “show floor” report as published in our Daily Newsletter.

Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
Published January 21

Cadence Design Systems kicked off its year with this announcement of intent to acquire NUMECA, expanding their system analysis tool offerings. There seems to be quite a bit of motion amongst the tier 1 EDA software companies in the system design space; this is yet another example.

Futurist, Writer and Manufacturing Tech Expert Travis Hessman to Keynote IPC APEX EXPO 2021
Published January 18

IPC APEX EXPO 2021 will be virtual this year, making this a virtual keynote. Whatever it might be that we give up by attending a virtual keynote, there are a few sure things: the presentation will be topical and thought-provoking, we’ll be able to hear the presenter, and there will definitely be a chair for all of us. See you there! 

The Government Circuit: IPC is Ready for the Year of Advocacy Ahead 
Published January 19 

Government relations is another area of near-constant updates and new developments. This dispatch from IPC’s Chris Mitchell and his team captures some of the current action. Frenetic is this column might make government relations seem right at the moment, there is undoubtedly much more underway. Get another glimpse of all the advocacy Chris’ team is up to. 

MivaTek’s New Technology and Market Drivers 
Published January 19 

I recently spoke with Brendan Hogan about the upcoming new product releases from MivaTek. The conversation flows naturally from the new products, to market drivers to, the idea that continuous improvement is at the core of the market drivers.

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Suggested Items

Today’s M&A: Right on Target

08/09/2022 | Nolan Johnson, I-Connect007
In this enlightening conversation with M&A specialist Tom Kastner, Nolan Johnson learns that it’s a buyer’s market—and a seller’s market too. This sets up an interesting dynamic no matter which side you might be on. What trends are in play that have led to this situation and how can you make the most of it? Tom shares valuable insights that will get you thinking and planning your own strategies.

Challenges of the 2022 PCB Market: The Party’s Over

08/08/2022 | Pete Starkey, I-Connect007
With his knowledgeable insight into the business and technology of the printed circuit industry, Dr. Shiuh-Kao Chiang, managing partner at Prismark Partners, has put a global perspective on the challenges of the 2022 PCB market. His presentation at the EIPC Summer Conference in Orebro, Sweden, on June 14 was eagerly awaited by an attentive audience, keen to share his vision. From his comments, it was clear that 2022 will be an interesting year and does not appear particularly friendly for the PCB business.

Plating on Silver: What’s Old is New Again

07/07/2022 | Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.



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