High Density Packaging User Group Announces Nippon Denkai Membership


Reading time ( words)

High Density Packaging (HDP) User Group is pleased to announce that Nippon Denkai has become our newest member.

“Nippon Denkai is excited to be a member of the HDP User Group. We look forward to learning from our member partners through the collaborative problem solving approach fostered by the HDP team. By contributing our knowledge in copper foils, we believe that our participation will assist in projects related to printed circuit board processing, reliability, and signal integrity.”, said Michael Coll, COO at Denkai America.

“It is an honor and a privilege to have Nippon Denkai join the outstanding companies working on HDP User Group projects. Their expertise and capability in copper foil manufacturing will contribute significantly to several of our projects, such as our copper surface vs. loss project, which is focused on high-speed signal integrity”, said Larry Marcanti, Executive Director of HDP User Group.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/05/2021 | Nolan Johnson, I-Connect007
Another active news week in the electronics industry! February is launching with a high-G burn, to be sure. And if you’re a fan of The Expanse, like I am, then you’ve probably already watched through to the Season 5 finale; this means you have attention to spare for industry news all of a sudden. And if you haven’t reached the current end of the line for The Expanse, then today’s list is just what you need while you catch up.

EIPC Technical Snapshot: PCB Surface Finishes

12/28/2020 | Pete Starkey, I-Connect007
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges

12/07/2020 | Pete Starkey, I-Connect007
The second day of the Electronic Circuits World Convention began with a keynote from Dr. Shiuh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communication network—the roll-out of which was continuing in spite of the coronavirus pandemic. Technical Editor Pete Starkey has more.



Copyright © 2021 I-Connect007. All rights reserved.