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Atotech Prices Initial Public Offering
February 5, 2021 | AtotechEstimated reading time: Less than a minute
Atotech Limited, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, has priced its initial public offering of 29,268,000 of its common shares at $17.00 per share. The shares are expected to begin trading on Thursday, February 4, 2021 on the New York Stock Exchange under the ticker symbol “ATC,” and the offering is expected to close on February 8, 2021, subject to customary closing conditions. The underwriters of the offering will also have a 30-day option to purchase up to an additional 4,390,200 common shares from certain affiliates of The Carlyle Group Inc. (the “selling shareholders”).
Citigroup, Credit Suisse, BofA Securities and J.P. Morgan are lead book-running managers for the proposed initial public offering. Additional book-running managers are Barclays, Deutsche Bank Securities, Jefferies, RBC Capital Markets, UBS Investment Bank, Baird, BMO Capital Markets and HSBC. The co-managers are TCG Capital Markets L.L.C. and Mischler Financial Group, Inc.
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04/09/2024 | WistronWistron Corporation announced that its wholly-owned subsidiary, Wise Cap Limited Company, has participated in a private placement of common shares for GEOSAT Aerospace & Technology Inc., investing a total of NT$1.0 billion.
Save the Date: 2024 NW Electronics Design & Manufacturing Expo (NEDME)
03/19/2024 | NEDMEThe Electronics Manufacturers Association of Oregon (EMA) and the Electronics Representatives Association (ERA) are thrilled to announce the 2024 NW Electronics Design & Manufacturing Expo (NEDME), scheduled for October 30th. NEDME is the Pacific Northwest’s premier platform for industry professionals to delve into the latest advancements and trends in electronics manufacturing.
Design Guidelines for Flexible Printed Circuits
02/15/2024 | Chris Keirstead, PFC Flexible CircuitsAn important but sometimes overlooked aspect of flex and rigid-flex fabrication and assembly is the flex circuit tail, which is attached to a rigid PCB with pressure-sensitive conductive adhesives. This sub-assembly is becoming very common. We often see this applied to glass displays and microelectronic applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/26/2024 | Marcy LaRont, PCB007 MagazineBelieve it or not, it’s nearly February. Though January always seems to start out slow post-holiday, it also seems to end in a flurry of news and activity across all sectors. Staying true to that, this late January week of news and information is a clear signal that we are now fully immersed in the new year, and we have a lot to accomplish. Here are my picks for this week’s must-read articles, columns, and news.