2020: A Year of Learning, Innovation for Taiyo America


Reading time ( words)

Fix: Yes, it’s very similar to the old days of the Vacrel dry film, or Morton’s Conformask. It’s the same principle: You’re dealing with a three-dimensional circuit board, so you’ve got to get that air out of there. For typical inner layer stuff, you don’t have to worry about that, so you can use a hot roll laminator.

Starkey: I was going to say, is this the sort of equipment that a flex circuit fabricator in the U.S. would already have, or would they invest in new equipment?

Fix: Yes. Fortunately, a lot of these customers have it from the old days. They’re probably dusting off their vacuum laminator from the back room where you’re storing stuff on top of it. But for the most part, people have the equipment. And if they don’t, it’s still popular equipment that is being produced, so I know that you can buy it. There are companies out of Italy that do it. And of course, you can buy this equipment anywhere in Asia.

Starkey: Effectively, you’ve got a fully conforming photo-imaged mask. It’s really taking the place of an adhesive-less coverlay.

Fix: Yes. The big push recently on the IC packaging side has been in getting thinner and thinner coatings that are flat. As we all know with liquids, if you screen print or spray something, it will always have a ripple effect. With the dry film systems, they generally vacuum the air out. But just before it comes out, while it’s still hot, it’s hit by a metal plate, and it flattens it out, so you get this really nice flat surface. For all the assemblers, that’s right up their alley: a nice flat surface, the under-fill’s going to flow well, and everything’s going to process out really well.

Starkey: It sounds like a product that will have an enormous amount of interest. In terms of its durability, does that align with the durability you’d expect from a normal rigid solder mask?

Fix: Yes. It still passes all the required IPC type testing, and you have the flexibility as well. It has the VTM-0 UL rating, so it’s going to meet every requirement, and it already has many end user approvals. You’ll probably find it in just about every mobile phone out there, so you can tell which end users are approving those. But for the most part, it’s pretty much a drop-in product. We have all the big end users that already approve it. It’s pretty much an established process; people have been processing dry film for ages, so it’s nothing new. It’s just a matter of making that commitment to installing it into your production line.

Starkey: I’ve learned something that I think is really exciting. Thank you very much, indeed, John. I’m sure there are other products that are coming out of R&D.

Fix: Yes. You always hear about our updates on inkjet, so on March 9 at 11 a.m., with a replay at 4 p.m., we’ll have our virtual APEX New Product Presentation. You’ll see a presentation on our flex technology, and we’ll give some updates on inkjet as well. Right now, our lab is working on colors. We all have the standard green, but as you can imagine, in North America and Europe, the quick turn and prototyping requires different colors. So, we’re working on the basics: black will probably be next, followed by some blue, and red and white. Eventually, we’ll have the whole rainbow for inkjet. We could probably print your tie there, Pete.

Starkey: But this one has got the full periodic table printed on it (laughs).

Fix: We’re excited about inkjet, and Don Monn will be giving that update at our March 9 virtual presentation. It’s growing, and we keep telling people; you start small, but it’s doubling. We have many customers who are installing this, with more in the pipeline. We’ve already heard from three other customers who said that in the next three to four months they’re going to be installing an inkjet machine. It’s exciting when you see that people are grasping onto something new; they’re accepting it, and the end users are starting to accept it as well. We have some pretty impressive end users that have approved the inkjet through some of our customer base.

Our other new product is thermal management, and our technical manager, Jesse Session. will talk about that. Years ago, Taiyo introduced a heat spreader solder mask. This was a solder mask that would suck the heat out of the circuit board. When we first introduced it, and took it around to the end users, they weren’t all that impressed with our results, which was about two to three watts per meter Kelvin. We got great feedback from them, and they challenged us to try to get that to double digits. I went back to our lab, presented them with the challenge, and they came back with a material that dissipates 10 watts of heat. When you think about that, we’ve run tests on a circuit board, and you’re seeing that, under the same heat conditions, the circuit board is about 20°C cooler using this material.

It’s exciting right now. We have a couple big end-users looking at it, and it’s an interesting product in the sense that it has multiple applications. We see where it could be used as an under-fill, so if you have some type of processor or some type of chip package that creates a lot of heat, you could actually use this as the adhesive to help pull that heat out. It could just be a standard thermal interface material for the LED manufacturers. We have one that’s testing for that. Then, the simplest form is filling the via holes with it. We have a lot of products that we currently sell to the HDI market, and now this one adds an extra feature to it; it pulls the heat out. We have some testing going on with that, and we’re excited to introduce this. This is more of an OEM-driven type product that we need them to accept and pull through the supply chain. So, we’re focusing on doing that as well.

Starkey: I think thermal management is a big, big topic now. And what you’ve described has such a broad spectrum of applicability. That sounds like another a big winner. I’m really looking forward to hearing what Jesse Sessions has to say in the virtual presentation, John.

Fix: Yes, we’re looking forward to that. When you think of how our world is changing with the advances in 5G, internet of things, and autonomous cars around the corner, maybe people don’t realize all the circuitry involved in that. And with all that data being transferred, that’s energy, and energy is heat. We had to address this problem early on so that you didn’t have autonomous cars and other things overheating, and then a lot of the components wouldn’t work. That’s really a safety issue. With EV, you have a whole new technology there with battery packs. Thermal management has always been an issue and it’s becoming a bigger issue. You look at everyday things and everyone wants them to be smaller and more functional. But when you make these circuit boards smaller and tighter, where’s that heat going?

Starkey: Yes, it’s clear that solder mask has developed a little way beyond the green paint that we put on rigid circuit boards (laughs)!

Fix: We always say that it’s not a commodity. There is a difference between one solder mask and the other.

Starkey: It’s become a very, very technical product. John, thanks for your time, it’s been delightful to see you face-to-face, if only virtually. It’s been really interesting to listen to what you’ve had to say. I’m sorry we’ll miss the actual face-to-face at APEX, but I very much look forward to the virtual presentation. You’ve got some exciting products. I wish you well in the market, and we look forward to the next time we may meet.

Fix: Thank you, Pete. It’s always a pleasure, and it’s always fun seeing you. Give my best to Lyn. Hopefully I’ll see her the next time we do an EIPC event. All the best to you, stay safe, and I look forward to it.

Starkey: Thank you, John.

Share




Suggested Items

Technica Heats Up ROI Discussion

05/17/2022 | I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.

EIPC Technical Snapshot: Supporting Autonomous Driving

05/12/2022 | Pete Starkey, I-Connect007
EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/06/2022 | Andy Shaughnessy, I-Connect007
This week, we have some M&A news from Summit Interconnect, and a variety of columns. Chris Bonsell discusses the lack of preventive maintenance planning in PCB manufacturing, and Kelly Dack lays out some solder mask guidelines for PCB designers. Duane Benson helps make sense of the quoting process in a time of 50-week lead times, and Dan Beaulieu has a great review of a book about how shareholder policies have caused many of the problems we see in corporations today.



Copyright © 2022 I-Connect007. All rights reserved.