Insulectro to Host OEM Forum 'The Heat is On! Finding PCB Materials That Like it Hot' on Thursday, March 4


Reading time ( words)

Insulectro, the largest distributor of materials for use in the printed circuit board and printed electronics industries, will host an OEM forum on Thursday, March 4, at 11:05 a.m. Pacific. The topic is The Heat is On! Finding PCB Materials That Like it Hot! the forum will be conducted on the ZOOM teleconferencing platform and registration can be accessed here.

Join this 45-minute (or so) session to learn about automotive electrification, burn-in boards, and other thermally demanding PCB applications.

The session is hosted by veteran technical account manager Ron Murdock and will feature Insulectro panelist Chris Hunrath along with special Isola guest panelists: Michael Gay, Director of High Performance Products, and Steve Sekanina, Director of High speed Digital Products.

Michael Gay has been with Isola for 20 years and has 25 years of experience in laminate and PCB manufacturing industries.  He has held various positions at Isola which include Technical Sales Manager and Director Emerging Products Asia Pacific Region where his responsibilities ranged from new product introduction, PCB process development and technical support and troubleshooting for Isola customers. Since returning from his role in Asia, he has worked closely with major industry OEM’s to develop and qualify Isola materials for the next generation of technology.

Steven Sekanina is an industry veteran with more 30 years of experience in the printed circuit board industry including roles at Gould, Nelco and Amphenol.   Steven is a graduate of Kent State University where he majored in Business Management.  Steve has global product management responsibility for all of Isola’s HSD products.   Steven is currently in his 15th year with the company.

Insulectro Vice President of Technology Chris Hunrath CID+ is a well-known presence in the PCB industry. He is a frequent webinar panelist objectively providing OEMs and fabricators with recommendations on materials and processes reinforced with material science perspectives. Based out of Insulectro’s Silicon Valley distribution center, Hunrath is a “rapid-dial” resource for those needing quick guidance.

This Forum should be of particular interest to OEMs, engineers, and designers needing to understand the increasing importance placed on thermally reliable materials. Registration is required to join the session and attendees will need to use the above link to access the Zoom application or website to participate.

Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC® Inc., Pacothane, Focus Tech Chemicals, JX Nippon, TADCO, EMD Performance Materials, Shikoku, Shur-loc, Kemmer Praezision GmbH, Industrial Brush Corp, and Denkai America. Most recently high-performance lamination presses from InduBond® have been added to the product line.

These products are used by Insulectro customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, printed electronics, and medical. Insulectro combines its premier product offering with local inventory across North America in “customer-near” distribution centers, fabrication capabilities and backed up by expert customer and technical support services.

Share




Suggested Items

Ventec: Contextualizing the CHIPS Act

01/05/2023 | Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.

EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace

10/26/2022 | Pete Starkey, I-Connect007
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/14/2022 | Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.