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Arlon Electronic Materials has successfully completed an intensive two-day recertification audit by IPC Validation Services. This audit was focused on validating Arlon’s manufacturing processes and testing procedures. Arlon’s success in passing IPC Validation Services’ audit confirmed Arlon’s status in the electronics industry as a trusted manufacturer of high-performance laminate and prepreg products.
“Arlon is fully committed to providing the highest quality, most thermally robust polyimide laminate and prepreg products on the market. Successfully completing the audit of our facility by IPC Validation Services provides our customers with the added assurance of our commitment to consistency and quality in manufacturing.” stated John Wright, Arlon’s Quality Manager,
All of Arlon’s polyimide laminate and prepreg products are currently listed on the IPC Validation Services QualifiedProducts List (QPL). These include Arlon 33N, 35N, 84N, 85N, and 85HP which are certified to the requirements of IPC-4101E-WAM1 slash sheets 40 and 41. Additionally, Arlon’s 37N and 38N low flow polyimide prepregs are certified to the requirements of slash sheet 42.
About Arlon: Arlon EMD is a US manufacturer of specialty materials. Arlon has supplied materials for the North American, UK, European, Israeli and Asian markets for more than 35 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please visit our website at www.arlonemd.com.
Nolan Johnson, I-Connect007
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.
Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.
Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.