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Mike Brask, president and CEO of IPS, shares the technology customers in the PCB sector are most interested in and discusses increasing market demands.
Visit realtimewith.com now for all the interviews produced by I-Connect007 in partnership with the IPC at this year's event. Later this month, watch for Real Time with...IPC APEX EXPO 2021 Show & Tell 2021, our celebrated special annual post-show magazine.
Listen to the Real Time with… IPC APEX EXPO 2021 interview with Mike Brask now.
Patty Goldman, I-Connect007
Gosh, I sure missed the live event! I listened in on several technical sessions, the awards ceremony, the keynotes, and the Hall of Fame management session. I tried a couple of professional development courses but got the frownie face on my screen and didn’t go back in. I have almost 90 days(!) to browse them to my heart’s content, so what the heck. There were good points and a few not so good things about this first ever virtual conference. You probably experienced some yourself.
Andy Shaughnessy, I-Connect007
In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show. And in his latest column, Denny Fritz explains why the DoD is now thinking like many U.S. OEMs—worrying about single-source components, for instance—but the stakes are much higher.
Matt Kelly, IPC
I thought the three keynotes given by IPC President and CEO John Mitchell, Industry Week Editor-in-Chief Travis Hessman, and IPC Chief Economist Shawn DuBravac, were spot on. They all spoke to the fact that the way products are conceived, designed, manufactured, and used is changing rapidly. While the keynotes had different focus areas, I noted an important similarity—they all underscored the need for increased industry collaboration to help bring the factory and supply chain of the future to life.