-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 2, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
The Top 5 is labeled as “editor’s choice,” which is a good thing this week because if I were limited to just posting the five most viewed news items, this week’s list would be full of our own coverage for IPC APEX EXPO. Judging from the metrics, that content has been extremely popular. If you’re one of the seven or so readers who haven’t yet read through the IPC APEX EXPO coverage, then definitely download your copy of our special edition magazine, the Real Time With… IPC APEX EXPO Show & Tell issue. So, for this week, we’ll assume you’re reading our exclusive coverage already, and concentrate on the other news you need to read.
EIPC Technical Snapshot: 5G and Loss Minimisation
Published March 26
I-Connect007 Technical Editor Pete Starkey takes us to the most recent instantiation of the EIPC’s Technical Snapshot sessions, where this month’s topic was “5G and the understanding of loss minimization at the PCB level.” Speakers included Paul Waldner, Manfred Huschka, Julie Mouzon, and Martyn Gaudion. Pete’s review, as usual, is on point with this most relevant topic.
North American PCB Industry Sales Up 6.1% in February
Published March 26
Quoting the article, “PCB bookings in February increased 6 percent year-over-year. Bookings in February increased 14.3 percent from the previous month. ’PCB orders and shipments continue to trend higher,’ said Shawn DuBravac, IPC chief economist. ‘Orders during the month were especially strong, which carry shipments in the coming month.’”
This is encouraging news. Be sure to know the latest and share it with your colleagues. We’re all in this together.
Siemens Delivers Comprehensive Hardware-assisted Verification System
Published March 29
The Veloce hardware-assisted verification system for the rapid verification of highly sophisticated, next-generation integrated circuit (IC) designs is now public knowledge. This is the first complete offering of a highly cohesive system that Siemens claims “takes hardware, software and system verification to the next level of intelligent digitalization by streamlining and optimizing verification cycles while helping to reduce verification cost.”
The ECAD tools providers continue to push closer and closer to full-system design and simulation. And this direction fits with the idea of “digital twin.” At some point, the PCB will become a part of the entire simulation for chips, chip sets and board assemblies.
KYZEN to Present at SMTA China East Conference
Published March 29
Daniel Gao, KYZEN sales manager for Northern and Western China, will present during the SMTA China East Conference on April 22, to be held in Shanghai. Gao will present “The Relationship Between Cleanliness and Reliability/Durability.”
According to the press release, “Gao will explore how a PCB can achieve a ROSE value under the previous 1.56µg/cm² recommended limit, as well as industry acceptable limits of ion chromatography, yet still not meet the reliability and durability requirements of field operation.”
Learn how to avoid cleaning mistakes and reduce your costs while improving your brand reputation.
MacDermid Alpha a Supporting Partner at IMAPS Device Packaging Conference
Published March 30, 2021
MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. With a technical presentation on April 13, panel participation on April 15, and a MacDermid Alpha-hosted “Meet the Experts” forum on April 13, there will be plenty of opportunity to connect with the MacDermid Alpha staff during this event.
Suggested Items
Real Time with... IPC APEX EXPO 2024: Looking Back, Looking Forward With IEC
04/19/2024 | Real Time with...IPC APEX EXPOIEC came to the RTW booth and discussed both the legacy of IEC's past and the vision for its future. Industry veteran Bruno Ferri highlighted his quarter-century tenure in the industry and with IEC since its founding. He still exhibits boundless enthusiasm for the industry. Brando Stone, a young professional and a future face of IEC, talked about IEC's plans going forward and his experience at this year's IPC APEX EXPO.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
Two Industry Rising Stars Recognized at IPC APEX EXPO 2024
04/17/2024 | IPCTwo of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2024 in recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges. Award recipients were Naim Kapadia and Michael Schleicher.