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Summit Interconnect recently celebrated the grand opening of its newly renovated, state-of-the-art laboratory in Anaheim, California. After three months of renovation, and nearly $250,000 of capital investment, Summit Anaheim was excited to open the doors to its pristine 900 square foot laboratory. Some of the new equipment includes:
- (2) Keyence VHX-7000 4K digital microscopes
- (1) Struers Tegramin-30 automatic micro section grinder/polisher
- (3) Allied high tech twin prep 5x micro section grinder/polishers
- Conductor Analysis Technologies OM Thermal Stress System/D-coupon tester with reflow simulation & thermal shock capabilities
Vice President & General Manager Jack Evans said, “We’re very pleased with the way the new laboratory turned out. The added space and capabilities will allow us to better serve our customers while positioning the Anaheim division for several more years of growth.”
This project was one of the first completed in Summit’s CAPEX plan for 2021. Summit is committed to a strong reinvestment plan to continuously improve the Company’s capabilities, quality, and capacity. Additional improvements will be announced throughout the year.
Summit Interconnect provides a total solution for advanced technology PCBs including rigid, flex, rigid-flex and RF designs. Summit has three manufacturing locations in the U.S. and one in Canada making it one of the largest PCB companies in North America. Summit also provides value added global sourcing through trusted supply partners. Visit our website at www.summit-pcb.com.
Britta Schafsteller, Atotech
Immersion tin is well accepted as a high-reliability final finish in the industry. Due to its excellent corrosion resistance, it exhibits major market shares, particularly in the automotive industry. During the soldering process, an intermetallic compound (IMC) is formed between copper and tin. One remaining concern in the industry is the potential impact of the IMC on the solderability of the final finish. In this article, typical failure modes in soldering immersion tin are described and correlated to potential root causes for the defects.
I-Connect007 Editorial Team
Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.