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Stencil preparation is a new field of expertise where Ucamco’s new UcamX module, Stencil Toolbox, can help customers reach their goal.
Stencils are used to apply solder paste on the PCBs in a safe and accurate way. Exact amounts of solder paste must be calculated and the stencil must be shaped accordingly. The process of preparing stencils is rocket science and UcamX just became the perfect tool for an amazing lift-off.
The new UcamX module Stencil Toolbox offers benefits such as:
- Streamlined workflow saving you time and money
- Exquisite recognition of pad shapes
- Support for stencil specific shapes
- Instant overview on critical apertures
- Reshaping pads for optimal paste cohesion
- Nano coating support
- Technical drawing for your production
For those who wish to learn more, Ucamco will host a Stencil Toolbox webinar on June 1 at 4PM CEST. The webinar is free of charge and will take approximately 35 minutes.
Attendees will learn how to create stencils successfully, including how to use new selection methods, shape changes or home plate replacements, create drawings for your production, and use the visual aids to identify pad shapes.
Hungry for more? Recordings of the other webinars in our series (about YELO, Secure Etch Compensation, MultiJob Dynamic Panel Optimizer) are available at www.ucamco.com/en/webinars.