iNEMI to Hold Webinar on Copper Foil Surface Treatment Assessment

Reading time ( words)

The treatments typically used on copper foils are often essential for PCBs to survive thermal shock. However, the same treatments can have a detrimental effect on signal loss for high frequency/5G applications which require very low-profile copper foil and low-loss resin systems for optimum electrical performance.

iNEMI will be holding a call-for-participation webinar on May 27 and 28 to present how the Reliability & Loss Properties of Copper Foils for 5G Applications team plans to characterize various copper surface treatments to mitigate signal loss while still maintaining good adhesion and, hence, durability of the PCB.

iNEMI will review the increasing requirements for smooth copper to minimize signal loss within PCB structures, and how this smooth copper can be a challenge to reliability. In addition, the team plans a comparative study to determine signal loss from copper roughening by the pre-bonding chemical treatment during PCB fabrication (oxide alternative process). Ongoing developments in PCB material, fabrication and metrology will also be described.

The overall objective of the project will be to correlate surface finish to durability to signal loss in order to optimize the design and qualification of PCBs for future high-speed applications.

The sessions are open to industry; advance registration is required. For additional information about this project, contact Steve Payne at



Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

Isola Releases IS550H Material

04/26/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

EIPC Technical Snapshot: Supply Chain and Material Price Pressures

04/26/2021 | Pete Starkey, I-Connect007
EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”

Copyright © 2021 I-Connect007. All rights reserved.