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NASA Selects First Lunar Instruments for Artemis Astronaut Deployment

03/27/2024 | NASA
NASA has chosen the first science instruments designed for astronauts to deploy on the surface of the Moon during Artemis III. Once installed near the lunar South Pole, the three instruments will collect valuable scientific data about the lunar environment, the lunar interior, and how to sustain a long-duration human presence on the Moon, which will help prepare NASA to send astronauts to Mars.

Teledyne to Acquire Valeport

03/13/2024 | Teledyne
Teledyne Technologies Incorporated announced that it has entered into an agreement to acquire Valeport Holdings Limited and its affiliates.

Texas Instruments’ New Manufacturing Plant in North Texas Achieves LEED Gold Version 4

09/04/2023 | Texas Instruments
Texas Instruments (TI) announced its new 300-mm semiconductor wafer fabrication plant in Richardson, Texas, RFAB2, achieved LEED (Leadership in Energy and Environmental Design) Gold certification under version 4 (v4).

Lupita Maurer Appointed President at Polar Instruments, Inc

07/27/2023 | Polar Instruments
Coinciding with our move to new offices in central Beaverton, OR, Polar appoints Lupita Maurer as President of Polar Instruments, Inc.

The Pulse: Rough Roughness Reasoning

07/20/2023 | Martyn Gaudion -- Column: The Pulse
Reliable bonding reduces the risk of delamination through thermal stresses. The tried-and-tested way of achieving a good, reliable bond is to ensure that the copper is sufficiently rough to promote adhesion to the epoxy resin in the prepreg material. As materials and bonding technology improves, the copper surfaces can be made increasingly flatter and still achieve the desired reliability. In the future, new bonding methods—some already here but still on the high-priced side of the equation— may allow extremely flat copper to bond reliably. Meanwhile, as the industry is heading down the road of “smoother” copper, there is still a need to model the effects of a rough surface on signal transmission.
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