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IPC and Weiss Engineering have signed a cooperative agreement to deliver industry intelligence to the European electronics community, expanding on a partnership that began in 2020.
Philippe Leonard, senior director, IPC European operations stated, “Dieter Weiss is an incredible ambassador for the European EMS industry, and we look forward to working with him to help European manufacturers build electronics better.”
IPC will continue to focus on key European verticals like automotive, defense, industrial IOT, energy, and medical, and develop standards, create educational content, and champion advocacy to help members achieve operational excellence.
“in4ma’s [Weiss Engineering’s database] European EMS market statistics have become an important part of the strategic planning process for numerous companies in the European electronics manufacturing industry,” said Sanjay Huprikar, president of Europe and South Asia operations for IPC. “Our continued partnership with Dieter is expected to facilitate the creation of more innovative tools, studies, and analyses that can help our members better leverage their opportunities to greater financial success.”
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.