TTM Installs Orbotech Neos 800 Additive Printing Solution

Reading time ( words)

Orbotech, a KLA company, announced that TTM Technologies, a global manufacturer of printed circuit boards and radio frequency components and assemblies, purchased and installed an Orbotech Neos™ 800, transforming the way solder mask is applied to PCBs. The recently available Orbotech Neos 800 inkjet solution replaces conventional solder mask (SM) processing with innovative additive SM printing. In this new installation, TTM cut the SM sequence by half compared to the existing conventional process, making it more efficient, reducing chemical waste and significantly cutting manufacturing turn-around time – an important capability in today’s fast-moving electronics industry. 

TTM selected the Orbotech Neos 800 for its Stafford, Connecticut site following a rigorous testing and qualification program. TTM’s global PCB customers include leaders in aerospace, defense, automotive, computing and medical. 

“We are very excited to have brought this groundbreaking, environmentally-friendly technology in-house,” said Phil Titterton, chief operating officer at TTM Technologies. “Additive printing of solder mask is a significant improvement for us, as it eliminates process steps compared to the way we typically apply solder mask. This high-speed solution is 100% additive with no mess, less power, fewer chemicals, and substantial material savings. The Orbotech Neos enables us to increase our productivity in a smaller footprint on the factory floor while providing high-quality products to our customers.”

Currently available in the U.S. and Europe, the Orbotech Neos 800 combines several SM processing steps into a single multi-functional system, eliminating several manufacturing stages such as coating, tack-drying, exposure and developing. This streamlined, environmentally friendly, additive process increases productivity and ensures the consistent, high-quality printing that is critical to high volume manufacturing. It also enables reduced material and power consumption, as well as the associated labor and equipment maintenance costs, thereby decreasing the total cost of ownership. 

“The Orbotech Neos 800 is another example of a disruptive technology coming to market from Orbotech, validating our innovative approach to manufacturing” said Yair Alcobi, president of the PCB division at Orbotech. “In the short time since it has been available, this technology has gained traction with customers. We’re hearing from them that as the demand for advanced PCBs rises, shorter time to market and increased productivity with less waste and energy are the main drivers in their decisions to bring the Orbotech Neos on board.”

At the core of the Orbotech Neos are two proprietary technologies: the new Structural Printing Technology™, enabling 3D-like quality printing, and the field-proven DotStream Pro Technology™, enabling precise solder mask printing at high speeds. Orbotech Neos can also print serialization data including 2D barcodes at multiple levels for advanced traceability capabilities.



Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.

Copyright © 2021 I-Connect007. All rights reserved.