Printed Circuits Completes Qualification of Notion Direct Soldermask, Nomenclature Printer


Reading time ( words)

Rigid flex circuit board manufacturer Printed Circuits has completed the installation of the process line and qualification of their new Notion direct soldermask and nomenclature printer.

Printed Circuits purchased the Notion soldermask printer two years ago, and has built the processes to support accelerated manufacturing with the machine. They added an Pluritec UV-DF double sided UV cure unit for additional UV cure after the initial UV cure is done on the machine. They also added a Pluritec Thermotronic 3.5 tunnel oven to provide final soldermask cure on a conveyorized production line.

Printing soldermask and legend ink directly onto rigid flex printed circuit boards eliminates many process steps, accelerates manufacturing, improves accuracy, as well as adhesion and soldermask dam integrity. It also promises an order of magnitude reduction in the sizes of dams, giving their customers more real estate and capabilities on the outerlayers of their designs. 

Direct printing is the next generation technology for manufacturing advanced printed circuit boards. The machine offers four-point alignment to accurately align the mask to dimensional changes, such as offset, or rotation or even for trapezoidal distortion – critical capabilities for rigid flex designs. The machine is also capable of printing nomenclature with sequential serialization, as well as bar code and QR code marking capabilities. 

“This project is two years in the making and I am really happy to see this accomplishment,” said Matt Tannehill, Printed Circuit’s executive vice president. “More than that, I am proud of our team and the work they did on this. Their extensive internal testing and external qualification validated the processes, the technology and our commitment to it. Direct printing of soldermask is a terrific improvement for us. It eliminates six process steps per side, compared to the way we have been printing mask, and it is 100% additive with no waste or mess and each pass takes 38 seconds. One panel, with soldermask and nomenclature on both sides, can be done in less than three minutes. This will give our customers a much better product at a higher quality, while increasing our productivity in a much smaller footprint,” Tannehill explained. 

Share

Print


Suggested Items

Joe Fjelstad's Book Review: The Innovators

02/08/2021 | Joe Fjelstad, Verdant Electronics
"The Innovators: How a Group of Hackers, Geniuses, and Geeks Created the Digital Revolution" by Walter Isaacson is the best technology history book I have ever read, and at the same time one of the most engaging and entertaining. It is a forte of Isaacson to write biographies of great people. I have read his other books on DaVinci, Steve Jobs, Ben Franklin and Albert Einstein and found them equally brilliant. Isaacson has a number of other titles I have yet to get to in the future. He is a singularly great storyteller.

Book Excerpt: ‘Thermal Management: A Fabricator's Perspective,' Chapter 3

01/26/2021 | Anaya Vardya, American Standard Circuits
Conceptually, a metal-core board is exactly like it sounds—the metal is in the middle of the PCB sandwiched between layers on both sides. Just about any PCBA that will contain active heat-generating components can benefit when designed on a metal-core PCB. On a conventional PCB, the standard FR-4 layers are relatively poor thermal conductors, and heat is normally dissipated from active components using vias and thermal pads, as discussed earlier.

HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention

11/18/2020 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Audrey Sim, executive director and vice president of operations for the Hong Kong Printed Circuit Association, about the upcoming Electronic Circuits World Convention, to be held November 30 through December 2, 2020. Ms. Sim gives Nolan an overview of the conference’s history, its scope as a printed circuit industry conference, and its shift to a hybrid virtual/physical format for 2020.



Copyright © 2021 I-Connect007. All rights reserved.