Ventec, Taiyo America Sign Exclusive Distribution Agreement for Mainland Europe, UK


Reading time ( words)

Ventec International Group Co., Ltd., is pleased to announce it will be taking over the exclusive distribution of Taiyo products in mainland Europe, the UK and Ireland.

Ventec has a long-held commitment to providing best-in-class laminate & prepreg materials, including high-quality enhanced FR4, high-speed/low-loss material technology and an advanced range of high-performance thermal management solutions, supported by world class technical & service support, to customers around the world. With a long-term strategy to continuously invest in ownership and control of its complete sales process and supply chain for its PCB materials, Ventec has an established reputation for logistics excellence.

Effective October 1, 2021, customers in Europe will immediately benefit from the supply chain partnership with Ventec, as it will grant greater and faster access to Taiyo product inventories which will be stocked and fulfilled from Ventec’s distribution hubs in Germany and the United Kingdom. As a leading provider of specialty dielectric inks and via filling inks for use with microvia and build-up technologies, legend inks, dielectric and conductive ink products for the solar, lighting & display markets as well as thermal-cure and UV-cure solder masks, Taiyo America will continue to provide sales and technical support to its direct customers, with Ventec providing supply chain fulfillment and invoicing services. For all other customers, Ventec will offer sales, technical, supply chain / distribution support. The agreement also opens up the opportunity for Ventec to offer Taiyo’s innovative range of specialty inks and solder masks for printed circuit boards to Ventec’s own strong and varied customer base in Europe from industries including medical, aerospace, consumer electronics and automotive.

Mark Goodwin, COO EMEA & Americas at Ventec, said: “We are delighted to partner with Taiyo America as their exclusive pan-European distributor. Taiyo’s products have a reputation worldwide for proven performance and outstanding quality, which creates the perfect complement to Ventec’s existing material solutions. We are looking forward to supporting Taiyo’s existing customers and growing the business together by introducing Taiyo's products to our customers across our assigned region.”

John Fix, Manager & Director, Sales & Marketing at Taiyo America, added: "Taiyo America is pleased to partner with Ventec to distribute our product lines in Europe. Their reputation for providing leading-edge high-performance PCB base material solutions combined with their proven expertise in supply chain management will enable us to expand our market opportunities whilst enhancing our ability to meet the needs of our existing customers."

Ventec International Group Co., Ltd. (6672 TT) is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.

Share

Print


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.



Copyright © 2021 I-Connect007. All rights reserved.