AT&S Virtual Tech Days America


Reading time ( words)

Whether 5G applications, autonomous driving, high-performance computing, or innovative medical applications: The requirements for more speed, better performance, and higher efficiency are continuously increasing in all application areas. At the same time, the demands on new circuit board concepts and solutions for innovative connection technologies are increasing. These developments mean that the circuit board is no longer seen as a simple carrier of active and passive components. Rather, it is now an integral part of high-end electronic devices. New functionalities have to be integrated into the circuit board in order to meet the requirements created by new trends such as miniaturization, higher frequency ranges, lower latency times, or advanced thermal management.

These and many other topics will be covered at the AT&S Tech Days America, which will take place on September 14 and 15 in the “AT&S Virtual Showroom” and for which you can register at our website. Participants can learn more about the latest AT&S innovations.

“After the huge success of Tech Days Europe in spring, it was a logical step for us to make this format available to our customers on other continents in a virtual environment,” says Peter Schneider, CSO of AT&S AG. Exciting specialist lectures, presentations, and Q&A sessions will demonstrate how the latest AT&S technologies can improve the performance, efficiency, speed, and size of applications. “The virtual environment and the ambiance of the virtual showroom fit perfectly with the image of AT&S as one of the global technology leaders”, says Peter Schneider.

Share

Print


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.



Copyright © 2021 I-Connect007. All rights reserved.