Rogers Corporation to Highlight Thin Materials for Millimeter Wave Multilayer Designs at PCB West 2021


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Rogers Corporation will exhibit at PCB West in Santa Clara, CA (booth #201) highlighting some of its high-performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.

PCB West provides in-depth technical training and access to a host of leading suppliers to the printed circuit board design, fabrication, and assembly industry. Held at the Santa Clara Convention Center, the event takes place October 6th from 10:00 a.m. – 6:00 p.m.

Rogers Presentation

Rogers’ Technical Marketing Manager, John Coonrod, will present “Advancements in Prepreg Enabling New Applications for Millimeter-Wave and High Speed Digital” on Wednesday, October 6th, from 10 a.m. to 11:00 a.m. Coonrod’s presentation will include an introduction and overview of a new prepreg which meets the many requirements of fabrication and electrical performance, for multilayer PCB’s used in RF and High Speed Digital applications.  Some basic fabrication guidelines and capabilities for the prepreg will be given and data will be included showing RF performance.

Latest Rogers’ Materials at Booth 201:

CLTE-MW™ laminates now include lower profile and thinner copper foil options to better serve the needs of designers and PCB fabricators producing millimeter wave PCB circuit designs.  The new very low profile (VLP) ED copper cladding reduces insertion loss of transmission lines operating at 77 GHz by about 20% compared to standard ED copper foil.  Additionally, the new VLP copper cladding option is available in 9 µm, 18 µm and 35 µm thicknesses. These additional copper thickness options provide PCB fabricators more flexibility to achieve tight feature tolerances on signal layers, particularly with sequentially laminated designs. 

These laminates are well suited for a range of applications including millimeter wave automotive and industrial radar antennas, 5G millimeter wave base stations and backhaul radios, and phased array radar systems.

SpeedWave™ 300P Ultra-Low Loss Prepreg. With the increasing need for stackup flexibility in high layer count designs for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs, SpeedWave 300P prepreg offers a broad range of competitively priced high performance options for the circuit designer. SpeedWave 300P prepreg can be used to bond a variety of Rogers’ materials including XtremeSpeed™ RO1200™, CLTE-MW™, and RO4000® series laminates.

This prepreg system offers a low dielectric constant of 3.0 – 3.3 and a low dissipation factor of 0.0019 – 0.0022 at 10 GHz with stable performance over a broad frequency range. This material is offered in multiple spread and open weave glass styles and resin content combinations to maximize stackup options.

RO4000® Products for Multilayer Structures:

Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs. RO4835T™ laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835™ laminates when thinner cores are needed.

RO4450T™ 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 2.5, 3, 3.5, 4, 4.5, 5 or 6 mil thicknesses.

RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through-hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.

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