AT&S Names Philipp Gebhardt New Director Investor Relations

Reading time ( words)

Effective October 1, 2021 Philipp Gebhardt has taken over the position of “Director Investor Relations” at the internationally successful technology group AT&S. He succeeds Gerda Königstorfer, who will leave the company at her request. She will continue to work for AT&S until November 30, 2021, to ensure an orderly handover of all tasks.

Mr. Philipp Gebhardt has many years of experience in the field of IR work and will ensure the smooth continuation of capital market interaction for AT&S. The AT&S Management Board is pleased to welcome Philipp Gebhardt to the team and wishes him every success in his new position.

Born in Germany, Gebhardt studied economics at the Ludwig Maximilians University in Munich and obtained a CFA (Chartered Financial Analyst) degree. He has been working as a consultant and IR manager for international companies for more than 13 years and was most recently Director IR at Fresenius Medical Care in the USA and Germany.

The AT&S Management Board thanks Ms. Königstorfer for her commitment and her valuable contribution to the expansion and further development of AT&S’s capital market communication.



Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.

Copyright © 2021 I-Connect007. All rights reserved.