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LPKF Presents Innovations for PCB Manufacturing at productronica 2021
October 13, 2021 | LPKFEstimated reading time: 2 minutes
After months of webinars, online contact, and purely virtual events, LPKF is excited to be present at productronica 2021 – and hopes to greet numerous trade show visitors.
At the trade show, the technology company will present a depaneling automation solution for even faster and more cost-efficient cutting of populated boards with a laser – and easy line integration. A completely new, groundbreaking advancement in laser depaneling technology makes it possible to achieve results with exceptional quality at a higher cutting speed. This is all packed into a new system variant in the proven LPKF CuttingMaster 2000 series – which will be unveiled at the trade show.
Also in store for trade show visitors is a demonstration by LPKF of how quickly and easily printed circuit boards can be manufactured in an in-house lab. The company has been equipping labs and development centers in industry and science with circuit board plotters and laser machines for PCB prototyping as well as equipment for SMT applications for decades. The LPKF ProtoLaser U4 will be on display at the trade show as an example of a laser system for prototyping with, especially sensitive materials. This laser system uses a scanner-guided laser specifically developed for electronics labs with a wavelength in the UV region. It can be used to manufacture high-tech prototypes – without any other tools, masks, or films.
With a space-saving, simple, yet reliable process for advanced packaging of integrated circuits – active mold packaging (AMP) – LPKF is already now participating in the development of the upcoming 6G telecommunications standard.
In the laser plastic welding business unit, LPKF sees a lot of overlap with electronics manufacturing – whether in the welding of PCB housings or in the joining of plastics that enrich the innovative field of e-mobility.
Moreover, LPKF has a genuine world’s first here: with LPKF systems, special LDS materials can now be joined. LDS, which stands for “laser direct structuring,” is a leading process in molded interconnect device technology. With it, conductive traces can be produced right on the surfaces of injection-molded components, thus allowing mechanical and electronic functions to be integrated directly on molded parts. Through the new joining possibility, LPKF is paving the way for more flexibility, miniaturization, and functional integration.
LPKF division LaserMicronics, which offers services in the fields of micromachining of materials and laser plastic welding, will present its services at the trade show booth.
As in previous years, visitors to Productronica will find the laser specialist in its familiar place in Hall B2 at Booth 303.
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04/18/2024 | Martyn Gaudion -- Column: The PulseHow did a product aimed at signal integrity end up being more about documentation? For a little backstory, the Polar team has an unspoken “no business speak” rule at certain times. So, why is this column titled “Drilling Down?” I find it fascinating when a company sets off in one direction, but customers steer it in another. That’s what has happened here as customers took a product down a fork in the road we couldn’t predict. Your destination isn’t always where you initially set off to go, and that’s how we got to our subject of drills and drill documentation.
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Marcy's Musings: The Growing Industry
04/16/2024 | Marcy LaRont -- Column: Marcy's MusingsAfter decades of steady decline in the U.S. and Europe, the PCB industry is finally growing, especially in China Plus One countries. The U.S. for example, which seemed to have abdicated its title as the world leader in innovating high-technology cutting-edge manufacturing processes, is now in a race to regain what it lost and then some. The PCB fabrication industry is growing in the West, thanks to DoD funding, the CHIPS and Science Act, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act.
PCB007 Magazine April 2024 — The Growing Industry Issue
04/15/2024 | I-Connect007 Editorial TeamAfter more than two decades of steady decline in the U.S., the PCB industry is finally growing in the West thanks to the CHIPS and Science Act, DoD funding, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act. The U.S. is now in a race to regain what was lost and then some. But what does “growing” look like for the organizations that have received DoD funding, and for the rest of us? How can we sustain this growth?