High Density Packaging User Group Announces Uyemura Membership

Reading time ( words)

High Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.

“As our focus expands from our traditional stronghold in PCB processes into complex assembly processes – especially the high frequency and medical device arenas - we look forward to working with HDP member companies,” said Rich DePoto, Uyemura Business Development Manager.

“I am pleased to welcome Uyemura to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise in surface treatment processes for electronics will contribute significantly to several of our projects, especially those focused on high frequency applications and emerging technologies,” said Larry Marcanti, Executive Director of HDP User Group.

About Uyemura

Uyemura is a science company founded in 1848, with core competencies in the development, testing, and manufacture of process chemistries for the PCB, semiconductor, sensor, photonics and medical device industries.

Uyemura has often been characterized as a disruptor – (long before that became a popular term!) Many Uyemura products have re-invented the solutions of the past, often dramatically, rendering legacy products obsolete, and establishing new benchmarks for performance, longevity, and cost management.

Uyemura was the first company in the industry to establish a research laboratory (today, there are 5 worldwide) as an institution for interdisciplinary surface treatment research. Our global R&D activities have generously rewarded the Uyemura brand with the confidence of leading OEMs in virtually every sector.

More information can be found at: https://www.uyemura.com/index.html

About HDP

HDP User Group, a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Tokyo.

For more information, visit HDP User Group on the Internet at www.hdpug.org.


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.

Copyright © 2022 I-Connect007. All rights reserved.