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KLA Corporation announced operating results for its first quarter of fiscal year 2022, which ended on September 30, 2021, and reported GAAP net income attributable to KLA of $1.07 billion and GAAP earnings per diluted share attributable to KLA of $6.96 on revenue of $2.08 billion.
"KLA's track record of consistent execution and sustainable outperformance was evident during the September 2021 quarter, demonstrating the strong momentum in our core markets and the attractive operating leverage inherent in the KLA financial model," commented Rick Wallace, president and chief executive officer of KLA Corporation. "KLA continues to outperform expectations despite significant supply chain challenges by operating with purpose and precision and focusing on creating value for our customers, partners, and shareholders alike. KLA's execution is powered by our global teams continuing to go above and beyond, to meet the challenges and opportunities of the marketplace."
Second Quarter Fiscal 2022 Guidance
The following details our guidance for the second quarter of fiscal 2022 ending in December:
- Total revenue between $2,225 million to $2,425 million
- GAAP gross margin is expected to be in a range of 60.2% to 62.3%
- Non-GAAP gross margin is expected to be in a range of 62.0% to 64.0%
- GAAP diluted EPS attributable to KLA is expected to be in a range of $4.69 to $5.59
- Non-GAAP diluted EPS attributable to KLA in a range of $4.95 to $5.85
Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.
Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.