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International Electronics Circuit Exhibition (Shenzhen) Rescheduled to January 2022
December 1, 2021 | HKPCAEstimated reading time: Less than a minute
The organizing committee of the International Electronics Circuit Exhibition has decided to reschedule the 2021 exhibition from 8–10 December 2021 to 5–7 January 2022.
The show venue will remain unchanged in Halls 5–8 of the Shenzhen World Exhibition & Convention Center (Bao’an). The organizers will continue to make every effort to prepare for the exhibition, maintain close communication with all relevant parties, and closely monitor the development of the pandemic. The exhibitors are being encouraged to make corresponding re-scheduling arrangements.
For more information, visit the official website at www.hkpcashow.org and official WeChat at “PCB_SMT” for the latest show update.
Suggested Items
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.
What’s Next Becomes Now at IPC APEX EXPO 2024
04/22/2024 | IPCFrom revolutionary advancements in artificial intelligence, augmented reality and the latest innovations in capital equipment on the show floor to a heightened learner experience through the 16th Electronic Circuits World Convention (ECWC16) technical conference, IPC APEX EXPO 2024 provided education, professional development and numerous networking opportunities, for 3,723 attendees from 57 countries.
SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
04/18/2024 | SEMIThe SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.
Phil Kinner Pushes His Limits in Engineering and Running
04/17/2024 | Linda Stepanich, IPCEngineers break things on purpose. They like the challenge of putting things back together and making them stronger and more resilient. The skills engineers use to build products can also be used to rebuild their lives after a personal loss, something Phil Kinner learned when he laced up his running shoes after many years of a sedentary lifestyle.
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.