American Standard Circuits Utilizes Averatek Process for Medical Technology

Reading time ( words)

Mr. Anaya Vardya, President and CEO of American Standard Circuits recently discussed how using the Averatek A-SAP™ process allows his company to better service their medical electronics customers.

When commenting on this process Mr. Vardya explained, “Our medical electronics customers depend on us to provide them with the most reliable PCBs possible. When dealing with medical products it is not hyperbole to say that it is always a matter of life or death. With the A-SAP™ manufacturing process ASC can now provide our customers with ultra high-density technology, 25 micron trace and space, and improved reliability, reducing layer counts and micro via lamination cycles, ultimately simplifying the design.  Other advantages include improved signal intergrity, aspect ratios greater than 1:1 for metal traces and extremely tight tolerances.  Specific to medical technology, this process is not limited to copper conductors and enables the use of gold as a conductive metal to deliver bio-compatibility advantages.  In many instances the reduced layer count allows for improved costs which we then pass on to our medical customers. It’s a win-win situation for both of us.”

Visit I-007eBooks to download your copies of American Standard Circuits’ micro eBooks today:
The Printed Circuit Designer’s Guide to... Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
The Printed Circuit Designer’s Guide to... Thermal Management: A Fabricator’s Perspective

And be sure to check out Realtime with... American Standard Circuits to learn more!

About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question go to www.asc-i.com.

 

 

05/23/2023 | Barry Matties and Nolan Johnson, I-Connect007

Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.

05/17/2023 | Andy Shaughnessy, Design007 Magazine

At the SMTA Atlanta Expo and Tech Forum, I spoke with NCAB Group Field Application Engineer Ramon Roche, who gave a presentation at the show titled, “Technical Trends in the Global PCB Industry.” Ramon and I discussed his presentation, the emerging technologies that have NCAB’s focus over the next few years, and why semi-additive processes may be the key to succeeding with ultra HDI technology.

05/10/2023 | Pete Starkey, I-Connect007

It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.