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At IPC APEX Expo 2022 in San Diego, Ventec International Group Co., Ltd. (6672 TT) will be premiering ‘aerolam’ in the US-market. A base-material solutions set, aerolam is specifically curated for the diverse and unique requirements of aerospace & defense applications. From January 25 to 27, the Ventec team will be on hand at booth #3325 for the unveiling of aerolam and to showcase its unique laminate & prepreg capability across a very wide range of applications and budgets.
The evolution of aerospace and defense (A&D) electronics is accelerating at a staggering pace, driving the demand for reliable high-performance materials that maintain mechanical and electrical integrity in harsh mission-critical operating conditions. Paying attention to the properties of materials at the substrate level is the first step towards achieving the most stringent performance targets of today's A&D manufacturers.
Whatever the substrates must handle – high-speed digital signals, high RF frequencies, intense heat dissipation, extreme environmental stresses – the aerolam portfolio guides designers and manufacturers of high-performance A&D electronics to high-quality products that are ready to meet those demands and are supported by all the necessary documentation including test schedules and certificates of conformity.
The aerolam portfolio caters for the complete spectrum of A&D application scenarios, from equipment intended to operate in a relatively benign environment such as inside a command-and-control center, to high-performance fielded systems that must withstand the toughest conditions including extreme temperatures, high vibration and g-forces, salt spray, and humidity that challenge reliability to the utmost.
Ventec’s Quality Management Systems are of course accredited with AS9100 quality standard, and conversant with applicable IPC, space agency and MIL-STD specifications, reflecting Ventec’s commitment to meet the strictest industry requirements for aerospace-related products.
Check out this additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh (a free eBook available for download)
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007e Book library here
