I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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Next week, we’ll be in San Diego. In fact, I fly down tomorrow morning to start preparations, along with most of the I-Connect007 team. The weather forecast says to expect sunny, with the occasional cloud, all week, with daytime temperatures around 70 degrees. That’ll be nice, as I’m sure COVID-related social distancing guidelines will encourage us to socialize outside as much as is feasible.

Don’t get me wrong, the team is very excited to be covering the IPC APEX EXPO week in-person. We’ll be practicing our exposure minimization and proper social distancing as best as we can, however. We will also be covering the virtual AltiumLive event, which overlaps with IPC APEX EXPO. Expect to see Andy Shaughnessy and other I-Connect007 faces reporting on both events next week.

Andy and I have been creating these must-read lists since June of 2020, five months after the last in-person IPC APEX EXPO—yes, it’s been that long! So, this is the first of our five must-reads covering the lead-up week to a physical show. No surprise then that reader interest has been somewhat APEX- and AltiumLive-centric this week. Here are the top five standouts from a busy, busy week of news.

Best Technical Papers at IPC APEX EXPO 2022 Selected 
Published January 14

In the article, IPC Chief Technologist, Matt Kelly, says, ““The [Technical Program Committee] is absolutely focused on providing highest quality content to the technical conference. This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners." Click through to see who those award recipients are.

Booming Semiconductors: AT&S Shaping Coming Data Revolution 
Published January 17

This news piece updates readers on what AT&S presented for latest latest developments in the field of IC substrates at the Consumer Electronics Show CES in Las Vegas. Substrates are key to the semiconductor chips that get placed on the printed circuit boards; keeping up on the latest in semiconductor substrates just makes sense.

Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions 
Published January 17

I-Connect007 speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges.

Mycronic to Demonstrate Enhanced Process Control Solutions for Flexible PCB Assembly at IPC APEX EXPO
Published January 19, 2022

From the press release, “Mycronic will continue to demonstrate the benefits of the flexible factory at IPC APEX EXPO in San Diego, January 25-27, 2022. In addition to the latest in integrated SMT assembly solutions, advanced jet printing technology, dispensing and material handling solutions, the company will highlight recent advances in 3D inspection technologies, process analysis tools and process control software.” Click through to read more.

MacDermid Alpha’s Electrolube to Present Two Keynotes on Resins and Coatings at IPC APEX EXPO 
Published January 20

Phil Kinner, global business and technical director for Electrolube’s Coatings Division, and Beth Turner, Electrolube’s senior technical manager, will both present papers at the event. Kinner’s is titled “Conformal Coatings: State of the Industry Versus State of the Art,” and Turner’s is titled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment.” Click through for more details.

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/20/2022 | Andy Shaughnessy, I-Connect007
This week, we bring you an article about manufacturing training for veterans, and a review of a great signal integrity webinar. IPC honors its A-Teams with the coveted Golden Gnome Awards, and Technica discusses various ways for fabricators to increase ROI. Dan Beaulieu has a review of a really cool book: Back to Human—How Great Leaders Create Connection in the Age of Isolation. In spite of all the meetings on Teams and Zoom, it’s easy to feel disconnected. But great leaders find a way to foster that connectivity.

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

05/16/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.



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