MacDermid Alpha to Exhibit, Present at the IMAPS Device Packaging Conference

Reading time ( words)

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.

Jianwen Han, Principal Research Scientist, will be presenting “Electrochemical Plating System Development of Nano-twinned Cu for Multiple WLP Features”. The paper discusses the development of a series of electrochemical plating baths and processes, generating nano-twinned Cu in wafer-level packaging applications to fulfill the expanding market demand for copper-to-copper direct bonding and hybrid-bonding. This newly developed system shows a high density of nt-Cu (close to 100%), controllable grain size (0.10 to 1.0 micron), vertical columnar structure, and minimal transition layer between Cu seed and nt-Cu initial position.

Featured in the booth will be the MacDermid Enthone brand of product offerings from the Circuitry Solutions division that enable upgraded FCCSP and PCBGA fabrication. Highlighted will be the entire Systek family of high-performance build-up processes for IC Substrates and their integrated leadframe product portfolio which incorporates connected solutions and spans the entire process of building QFN packages from leadframe roughening to enhancing sidewall solderability for enhanced reliability.

The Alpha, Kester, and MacDermid Enthone brands from the Semiconductor division will promote MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications and ATROX CF200-1D an electrically conductive die attach film with thermal conductivity of >20 W/m-K. Also highlighted will be their complete line of STAYSTICK and STAYCHIP adhesives for structural and functional bonding.

The Compugraphics brand, will showcase their complete line of photomask solutions and support services. From 1X master photomasks and reticles to pellicle replacement, MPT coating and photomask cleaning, with quick-turn service, they are a partner you can reply on.

MacDermid Alpha’s team of industry experts from their Circuitry and Semiconductor divisions will be available at booth #23/24 to discuss the challenges the semiconductor and IC substrate manufacturing sectors face as technology continues to push the limits of performance and miniaturization.


Suggested Items

EIPC Technical Snapshot: Novel Laser-based Manufacturing Processes in Automotive Electronics

09/22/2022 | Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.

Plating on Silver: What’s Old is New Again

07/07/2022 | Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

Copyright © 2022 I-Connect007. All rights reserved.