MacDermid Alpha to Present on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference

Reading time ( words)

MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in innovative electronics design and manufacturing, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.

Dr. Nirmalya Kumar Chaki, Manager, Advanced Materials Research will present his recent research as part of the Functional Materials session. His presentation will focus on three central technologies; compatible electronic inks for In-Mold electronics, formable silver inks, dielectric inks and adhesives, in addition to structural, 3D In-Mold Electronics demonstrators.  In-Mold Electronics (IME) technology integrates the existing Film Insert Molding (FIM) process with electronics, which allows for design freedom and manufacturing flexibility, as well as savings in costs, weight reduction and a 30% decrease in carbon footprint. With the addition of conductive circuits using MacDermid Alpha’s electronic inks, only one process is required to produce conformable (non-rectangular/planar/freeform) automotive parts with embedded functional electronics. Applications for this technology in automotive interiors include in-vehicle infotainment, overhead console panels (OHCP), center console, and audio controls. 

MacDermid Alpha is developing a suite of conductive inks and materials to meet the unique requirements and reliability standards for Peel-N-Stick Sensors and In-Mold Electronics. We offer a comprehensive suite of fully compatible materials, processing and applications support for our films, electronic inks & adhesives to produce 3D Smart, Functional and 3D Automotive HMI (Human-Machine Interface) Structures. Our film capabilities include functional and decorative solutions, such as Autotype heat-stabilized PET and PC films. Additionally, our electronic materials portfolio provides integrated electronics capabilities for the printed circuit board and semiconductor industries. We provide solutions for the entire electronics device stack, due to the inter-compatibility & adhesion of our substrates and electronic ink layers.

MacDermid Alpha’s products for Peel-N-Stick Sensors & IME include:

  • Formable PET & PC Films / Substrates
  • Formable Conductive Inks
  • Formable Dielectric Inks
  • Electronic Joining Materials

Dr. Chaki will be delivering his paper on Wednesday, March 23 at 5:20 pm. To register for the presentation, please visit the LOPEC website.


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/23/2022 | Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.

IPC: Companies Are Intentional About Tracking Environmental and Social Risks

09/22/2022 | Suhani Chitalia and Kelly Scanlon, IPC
Leading companies in the electronics manufacturing industry are highly intentional about their environmental, social and governance (ESG) priorities, with climate change and energy use among the most closely scrutinized issues, an IPC analysis shows. As part of IPC’s ESG for Electronics initiative, IPC is interested in developing resources for members on the most common ESG methods and priorities of leading companies across the electronics value chain. In support of this, IPC has preliminarily analyzed the ESG reports of approximately a dozen companies in selected portions of the industry.

EIPC Technical Snapshot: Novel Laser-based Manufacturing Processes in Automotive Electronics

09/22/2022 | Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.

Copyright © 2022 I-Connect007. All rights reserved.