-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Material Application for Mini Backlight Unit
April 12, 2022 | Aaron Chen, Wazam New Material Co. Ltd.Estimated reading time: 1 minute
In 1980, about 90% of the materials used to make PCBs was FR-4. As time went by, technology developed, and electronic devices relentlessly integrated into every area of our lives. The constant acceleration of upgrading meant endless challenges and opportunities for CCL suppliers. Wazam New Material Co. Ltd. is a CCL supplier that strives to be attentive to the needs of its end customers and provide comprehensive solutions.
One example is the MBLU application material. Since 2021, mini LED backlight has become the focus direction of mainstream technology improvements. As the size of chips and optical distance has become increasingly smaller, the assurance of a product’s reliability has put an even stricter demand on the reliability of the whole supply chain.
A deviation that was acceptable before has become intolerable. As seen in Figure 1, with the same deviation, the effective soldering area has reduced from 50% to only 5%. To improve the performance rate and the effectiveness of the LED Die Bonder, PCBs must have products with sizes that are more stable.
The traditional FR-4 material’s thermal expansion rate is around 0.04%. As we brought in the polyimide resin, the heat resistence and size stability has been improved. Together with carefully selecting the filler materials and readjusting the proportion, Wazam was able to reduce the material’s thermal expansion rate to about 0.015%.
To read this entire article, which appeared in the March 2022 issue of PCB007 Magazine, click here.
Suggested Items
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family With New Synchro 3 Release
04/03/2024 | BUSINESS WIRENordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, releases the Synchro™ 3, a new model in the SELECT® Synchro™ selective soldering equipment family for high-volume printed circuit board assembly applications.
Revolutionizing Precision Soldering: Introducing the iBot-i1/2s by Sasinno Americas
04/02/2024 | Sasinno AmericasSasinno Americas is pleased to introduce its latest advancement in soldering technology – the iBot-i1/2s. This cutting-edge system redefines precision soldering with groundbreaking features designed to elevate efficiency and performance in electronics manufacturing processes.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.