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In 1980, about 90% of the materials used to make PCBs was FR-4. As time went by, technology developed, and electronic devices relentlessly integrated into every area of our lives. The constant acceleration of upgrading meant endless challenges and opportunities for CCL suppliers. Wazam New Material Co. Ltd. is a CCL supplier that strives to be attentive to the needs of its end customers and provide comprehensive solutions.
One example is the MBLU application material. Since 2021, mini LED backlight has become the focus direction of mainstream technology improvements. As the size of chips and optical distance has become increasingly smaller, the assurance of a product’s reliability has put an even stricter demand on the reliability of the whole supply chain.
A deviation that was acceptable before has become intolerable. As seen in Figure 1, with the same deviation, the effective soldering area has reduced from 50% to only 5%. To improve the performance rate and the effectiveness of the LED Die Bonder, PCBs must have products with sizes that are more stable.
The traditional FR-4 material’s thermal expansion rate is around 0.04%. As we brought in the polyimide resin, the heat resistence and size stability has been improved. Together with carefully selecting the filler materials and readjusting the proportion, Wazam was able to reduce the material’s thermal expansion rate to about 0.015%.
To read this entire article, which appeared in the March 2022 issue of PCB007 Magazine, click here.
Nolan Johnson, PCB007 Magazine
Kelly Dack and Nolan Johnson explore the silver linings from the past two years, especially the importance of good communication. These skills are—as they have always been—key to the success of the project. But how do you define the best methods for communication? Kelly breaks down four personality types and why it’s important to recognize how one person differs from another. When you better understand how a person thinks, your level of effective communication increases exponentially.
Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.
Nolan Johnson, I-Connect007
In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed!
These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.