-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper
April 14, 2022 | Jordan Kologe and Leslie Kim, MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
Introduction
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority. Over the past year, we have seen printed circuit board manufacturers encounter challenges associated with environmental regulations, water and power outages, and pressures from the supply chain to reduce environmental footprints.
From the perspective of a board fabricator, especially one that specializes in HDI, a highly resource-intensive step in the process of making a printed circuit board is the primary metallization step. All circuit boards that have multiple layers go through such a primary metallization, which is either electroless copper or direct metallization (DM). The main difference between a direct metallization process and the more traditional electroless copper plating process is that the former deposits a paint-like conductive coating through absorption onto the surface, while the latter deposits a copper coating from solution through chemical reduction. The DM coatings are most typically a carbon or graphite, and this kind of board manufacturing has been done reliably for nearly four decades.
Electroless copper processes have a larger carbon footprint than direct metallization for several reasons. Compared to direct metallization, electroless copper is more water and energy intensive, has a higher variety and amount of chemical ingredients, and has higher process variation. When looking at the comparison from the perspective of HDI, the impact of all of this becomes even more critical.
HDI—Why Direct Metallization?
In conventional PCB multilayer, the primary metallization step is utilized once all innerlayers of the board have been laminated and drilled and the board is nearing completion. The microvia structure is the central feature of HDI that allows for the manufacture of high-density circuit boards today. The microvia essentially replaces the singular through-hole that connects multiple layers and allows individual layers to be routed to their neighbors directly and separately from other layers. To achieve this feat of engineering, however, every single build-up operation that the board goes through requires an additional run through a primary metallization step.
It is for this reason that the electroless copper and direct metallization are under constant scrutiny from a reliability perspective. Yet, as we will discuss shortly, the sustainability question has not been widely examined. This is important since the volume of boards in the industry that use microvia designs is as high as it has ever been and will continue to grow to meet the needs of any electronic design that can economically benefit from increased circuit density.
Can we create an ever-increasing amount of printed circuit boards with HDI technologies such as mSAP while also meeting increasingly strict targets for carbon mitigation, while also meeting profitability expectations?
To read this entire article, which appeared in the February 2022 issue of PCB007 Magazine, click here.
Suggested Items
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?