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Designing Electronics for High Thermal Loads

04/16/2024 | Akber Roy, Rush PCB Inc.
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.

SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas

04/16/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.

Microchip Technology Acquires Neuronix AI Labs

04/16/2024 | Microchip Technology Inc.
Innovative technology enhances AI-enabled intelligent edge solutions and increases neural networking capabilities.

Teledyne FLIR Defense Awarded $249M IDIQ Contract for U.S. Marine Corps Organic Precision Fires-Light Program

04/15/2024 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has been awarded an Indefinite Delivery/Indefinite Quantity (IDIQ) contract worth up to $249 million by the U.S. Marine Corps Systems Command for its Organic Precision Fires-Light (OPF-L) program. The initial delivery order is valued at $12 million.

Material Insight: The Importance of Standards for the Chip Packaging Industry

04/12/2024 | Dr. Preeya Kuray -- Column: Material Insight
I had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.
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