Addressing the Gap in Process Performance
April 26, 2022 | Nolan Johnson, PCB007Estimated reading time: 1 minute
The first steps in process improvement are to determine what the gap is and why it happens. Having a process is not sufficient; the process needs to be effective as well. For those responsible for creating and maintaining processes, the ultimate goal is to create a procedure that becomes self-perpetuating, that seeps into the fabric of the company’s culture. For better or worse, plenty of procedures do indeed become ingrained in company culture. How does one go about ensuring that company culture is loaded with effective processes that deliver a positive outcome? That is the question, to be sure.
Analyzing Performance Problems, authored by Robert Mager and Peter Pipe, was published in 1970. Even 50 years later, it is still one of the most definitive—and digestible—books on the topic of skill gap analysis. Their model presents a thorough and effective method for troubleshooting performance problems.
According to Pipe and Mager, first identify the performance problem. To do so, make the key metrics:
- Measurable
- Observable
- Performance-based
Armed with the metrics, the next questions are critical to the analysis:
- Is it worth solving?
- Can we apply fast fixes?
- Are the consequences appropriate?
- Is there skill deficiency?
- Are there other causes?
- Which solutions are the best?
This analysis process is captured in the flowchart for Mager and Pipe’s model.
While this model might seem almost simplistic, my personal experience is that the power of the model comes from the simplicity. This model is not attempting to determine the specific fix; that is a separate scope. Instead, Mager and Pipe are merely attempting to perform the triage, to identify the nature of the breakdown in performance. Once the root cause of the breakdown is understood, the type of resolution can be determined. How exactly that resolution is implemented, of course, is often highly situationally dependent. There may be more than one solution, in fact. And in terms of the current challenges in upskilling, is this 50-year-old method still meaningful?
To read this entire article, which appeared in the April 2022 issue of PCB007 Magazine, click here.
Suggested Items
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum
04/25/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Ciudad Juarez Expo & Tech Forum, scheduled to take place Thursday, May 9, 2024 at the Injectronic Convention Center in Ciudad Jaurez, Chihuahua, Mexico. During the event the KYZEN Clean Team will focus on understencil cleaning products KYZEN E5631J and CYBERSOLV C8882.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.