iNEMI's End-of-Project Webinar: 1st Level Interconnect Void Characterization Project, Phase 2

Reading time ( words)

Phase 2 of the 1st Level Interconnect Void Characterization project focused on understanding the potentially adverse impact that voids in first level interconnect materials have on the reliability of the electrical interconnect. The formation of small voids can occur in solder-based flip chip joints during the assembly process. This can be a concern for applications that involve high electrical and thermal flux across flip chip packages because the presence of a void can accelerate complete open failure due to electromigration.

The project team conducted experiments to understand the relationship between voids and joint reliability (electrical and mechanical) and worked on recommendations for acceptable voiding characteristics for flip chip interconnects. This end-of-project webinar will present the reliability test results for first level interconnection — performed by electromigration, temperature cycle and thermal shock testing — and will include descriptions of the test packages, reliability test conditions, test data of cross-section images and EBSD data. 


This webinar is open to industry; advance registration is required, check iNEMI's website. Two webinars with the same content are scheduled — please join whichever one fits your schedule.

Session 1 (APAC)
Thursday, June 16, 2022
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT on June 15 (Americas)

Session 2 (Americas & Europe)
Thursday, June 16, 2022
9:00-10:00 a.m. EDT (Americas) 
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)


Suggested Items

ICT Seminar 2023 Review: Energy, Thermals, and Assistive Technology

03/16/2023 | Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

Paige Fiet: Forging a New Path

03/15/2023 | Patty Goldman, I-Connect007
As a young industry professional, Paige Fiet, a process engineer at TTM Logan, sees mentorship as a formative component of her success in IPC. Alongside the support and guidance of her mentors, Paige has distinguished herself as an emerging leader who brings a fresh perspective to the many topics currently of interest to the industry.

IPC APEX EXPO 2023 Special Session: Advanced Packaging

03/13/2023 | Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.