Bowman's Micro XRF Measures Smallest Features in Wafers, Microelectronics


Reading time ( words)

Bowman has introduced an important addition to its suite of precision XRF instruments used in the PCB, semiconductor and microelectronics industries. 

The Bowman A Series Micro XRF quickly measures the smallest features on semiconductors and microelectronics. It accommodates very large PCB panels, and wafers of any size, for full sample coverage and multi-point programmable automation. 

Poly-capillary optics focus the X-ray beam to 7.5 µm FWHM, the world’s smallest for XRF coating thickness analysis.  A 140X magnification camera measures features on that scale; a secondary, low magnification camera provides live-viewing of samples and “birds-eye” macro-view imaging. Bowman’s proprietary dual-camera system lets operators see the entire part, click the image to zoom with the high-mag camera, and quickly identify the feature of interest.

A programmable X-Y stage with movement of 23.6 in (600 mm) in each direction can handle the largest samples in the industry. The stage has precision down to +/- 1 µm for each axis, and is used to select and measure multiple points; Bowman pattern recognition software and auto-focus features also do this automatically. The system’s 3D mapping capability can be used to view the topography of ENIG, ENEPIG, EPIG and other elite processes.

A Series instruments include 7.5 µm optics with molybdenum anode tube (chromium and tungsten also available) and a high-resolution, large-window Silicon Drift Detector (SDD) which processes more than 2 million counts per second. SDDs are the standard, industry-wide, for complex thin films. The high count rate capability is key to achieving a low minimum detection limit (MDL) and highest spectral resolution.

A Series systems are distinctive in that they are cleanroom-ready, have the largest semiconductor stage movement on the market, and are supported worldwide by a service network that provides same-day response for every benchtop XRF requirement.  Equipment evaluation, selection, commissioning, maintenance and modernization is available for users of Bowman instruments, as well as other major XRF brands. 

Share




Suggested Items

Technica Heats Up ROI Discussion

05/17/2022 | I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.

EIPC Technical Snapshot: Supporting Autonomous Driving

05/12/2022 | Pete Starkey, I-Connect007
EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.

PCB Adoption of Innovations

03/01/2022 | Happy Holden, I-Connect007
For North America, there is a growing need for more ultra-high density HDI capability. Some of the reasons for the slower adoption of SAP/HDI fabrication may rest with two obstacles: Subtractive processes have difficulty as they approach 50-micron traces and spaces (0.002”), and it is not clear what the total system acquisition costs will be for ultra-HDI.



Copyright © 2022 I-Connect007. All rights reserved.