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Zero Defects International [ZDI] has announced the acquisition by Westak Circuits of four state-of-the-art Tagarno digital microscopes for utilization in their printed circuit board (PCB) manufacturing facilities located in Sunnyvale, California and Forest Grove, Oregon. These microscopes enable many inspection scenarios and will substantially enhance operator performance.
Louis George, Chief Operating Officer, mentioned selection factors including technical capabilities and equipment reliability, but also the importance placed upon ZDI's well known reputation for technical service and support. ZDI President, Michaela Brody, expressed appreciation for Westak's selection in the context of a highly competitive environment for this type of equipment.
Nolan Johnson, I-Connect007
In this conversation with Schweitzer Engineering Laboratories, we spoke with John Hendrickson, engineering director; Frank Harrill, vice president of security; and Jessi Hall, senior director of vertical engineering. We wanted to learn more about the best practices they developed while specifying, selecting, and preparing to install an entire facility’s worth of equipment all at the same time.
Andy Shaughnessy, Design007 Magazine
This week, we published a variety of articles, columns, and news items. But let’s have a special round of applause for Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), two members of the House of Representatives who sent the DoD a letter detailing the need for more production of PCBs and IC substrates in the United States. Republicans and Democrats have been mixing like oil and water lately, so it’s promising to see these two reach across the aisle and try to get something accomplished for the greater good.
Pete Starkey, I-Connect007
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.