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Matrix USA Promotes Sunil Shah to VP, New Product Development
June 8, 2022 | Matrix USA Inc.Estimated reading time: Less than a minute
“Matrix is pleased to announce that Sunil has been promoted to VP, New Product Development. Sunil has been with our Company for over 20 years, and during that time he has always exceeded expectations. With his extensive knowledge of Printed Circuit manufacturing, he will surely assist our customers by bringing the Products and Technologies of our Principals directly into North American PCB shops,” says Kieran Healy, President of Matrix Circuit Board Materials.
Sunil has been the major contributor to the Company’s growth in the High Tg FR-4 market, focusing on the Kingboard Product Group for the past 10 years.Going forward, he will now expand his focus and energy to include the Soldermask and Dryfilm segments. Over the next few months, you can expect to hear from Sunil, and some of these new technologies. Please give him a warm welcome as he makes the rounds.
Suggested Items
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
NCAB Appoints Tim Benjamin as New CFO
04/15/2024 | NCAB GroupNCAB Group has appointed Tim Benjamin as its new CFO. Tim has a long and broad experience of managerial business finance roles, including M&A and IT.
Plastronics and the New IPC Guidelines for In-mold Electronics (IME)
04/11/2024 | Barry Matties, I-Connect007In the ever-evolving world of electronics, the roads for the integration of electronics assemblies into 3D structures continue to grow into a set of technologies used to produce 3D plastronics parts and revolutionize mainly the automotive industry. IPC has been developing standards for this set of technologies, led by Francisco Fourcade, IPC electronics technology standards manager.
IEC USA Congratulates Bernie Consitt for 25 Years of Service
04/09/2024 | IECJoin us in celebrating Bernie Consitt's 25 years of service and camaraderie at IEC (International Electronic Components). Bernie has been instrumental in his role as Accounting Manager, helping to supervise, track, and evaluate day-to-day activities within the accounting team.