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Averatek Corporation has announced its participation in this year’s JPCA Show Exhibition and NPI Presentation June 15th through June 17th, at the Big Sight center in Tokyo, Japan, (Booth#: 5F-21).
Averatek will be presenting advanced HDI PCB and package substrate manufacturing technology A-SAP™ and associated new materials ACL™ and CBF™. Averatek will also jointly present with Toyo Aluminium K.K. (“Toyo”) about a new catalyzed aluminum foil (Ranafoil™) for A-SAP™ during the show. The Averatek Semi-Additive Process (A-SAP™) and these new materials allow for filling the technical gap between mSAP HDI PCB and the package substrates - and dramatically expand material selection flexibility in package substrate manufacturing.
Averatek will first present on Friday, June 17th, at the NPI presentation. Toyo will have a presentation on the same day at the NPI presentation. Both companies will share booth #5F-21 during the show June 15th through June 17th.
The Averatek Semi-Additive Process (A-SAP™) can be used for a variety of materials with very thin electroless base copper layer - unlike other semi-additive processes (SAPs). The palladium catalyst is formed by LMI™ (Liquid Metal Ink™), which allows for less than 10 nanometer of uniform metal coating with A-SAP™.
ACL™ (Aluminum Clad Laminate) and CBF™ (Catalyzed Build-up Film) use a catalyzed aluminum foil by Toyo which provides well-controlled surface texture for the process, and very uniformly coated palladium metal. Developed for outer and build-up layers, now ACL™ and CBF™ enhance the use of A-SAP™.
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