iNEMI Recognizes Accomplishments of Project Teams


Reading time ( words)

iNEMI recently recognized five project teams with the consortium’s Project Leadership Awards. This is the first year the award has been given and it recognizes project teams that have delivered in the any of the following areas:

  • Superior performance of electronics manufacturing practices
  • Superior technology and business results
  • Positive impact on the electronics manufacturing value chain and its ecosystem

The five project teams are briefly described below; additional details are available online.

“This award recognizes the contributions and accomplishments of iNEMI project teams, specifically the individuals from our member companies who comprise these teams,” says Shekhar Chandrashekhar, iNEMI CEO. “They are doing significant work that directly benefits their own companies but also has a long-term, positive impact on the electronics manufacturing value chain. 

“By working together and leveraging iNEMI’s collaborative platform, these project teams have helped their companies accelerate and reduce the risk of adopting new technologies while helping ensure supply chain readiness for the wider industry. The projects being recognized in this inaugural round of Project Leadership Awards represent the types of work at which iNEMI teams excel — development of tools, sharing of best practices, characterization of new materials and development of more efficient and/or effective test methods. Congratulations to all these teams.”

Eco-Impact Estimator, Phase 3 — Significantly updated iNEMI’s Eco-Impact Estimator tool, which helps users make better design choices earlier in the product life cycle, and they launched a web-based version of the tool at Purdue University.

Package Warpage Prediction and Characterization, Phase 5 — Characterized the material properties of organic substrate-based packages to better understand the impact of curing processes on package warpage, and derived a modelling framework to predict package warpage.

Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3— Provided data and insights into current AOI capabilities for measuring fine line and space (

Eco-Design Best Practices for a Circular Electronics Economy — Identified and communicated eco-design best practices derived from analysis of the shared approaches taken by several leading companies that are doing innovative/beyond-compliance eco-design work.

Conformal Coating Evaluation for Improved Environmental Protection, Phase 1 — Developed and evaluated a methodology for a conformal coating evaluation test that can be completed in less than a week and executed under temperature and humidity conditions representative of those in the field, which has the potential for significant cost saving for the industry.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/02/2022 | Nolan Johnson, I-Connect007
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

3D Electronic Devices With Additive Manufacturing

11/29/2022 | Shavi Spinzi, Nano Dimension
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.

Electronica 2022: Happy to Be Back in Munich

11/21/2022 | Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.