IPC Urges U.S. Senate and House to Complete R&D Legislation Before August Recess


Reading time ( words)

IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.

The Senate voted yesterday to proceed to debate on the bill, which includes more than $52 billion funding to implement the CHIPS Act and at least $2.5 billion for a new National Advanced Packaging Manufacturing Program. The motion passed 64-34, indicating strong bipartisan support. The bill may face additional changes as it is considered by the Senate.

A sense of urgency is driving action on the bill. Senate and House leaders want to send the bill to the President before the August district work period, which begins on July 27. Failure to enact the bill this summer would likely postpone final passage until after the November elections.

“IPC strongly supports passage of this bill,” said IPC President and CEO John Mitchell. “Companies engaged in standing up packaging and IC substrate facilities will have opportunities to tap into funding for R&D, new facilities, and workforce training through the programs authorized by the CHIPS Act. IPC is urging federal officials to structure these initiatives to deliver benefits across the electronics manufacturing industry.”

“However, the CHIPS Act is not a panacea,” he added. “Instead, it is a meaningful first step in helping to rebuild the U.S. electronics manufacturing industry. The Executive Branch and Congress must continue to support – through long-term policy and funding – the larger ecosystem that sustains innovative, resilient, and secure electronics manufacturing.” 

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/12/2022 | Andy Shaughnessy, I-Connect007
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.

Challenges of the 2022 PCB Market: The Party’s Over

08/08/2022 | Pete Starkey, I-Connect007
With his knowledgeable insight into the business and technology of the printed circuit industry, Dr. Shiuh-Kao Chiang, managing partner at Prismark Partners, has put a global perspective on the challenges of the 2022 PCB market. His presentation at the EIPC Summer Conference in Orebro, Sweden, on June 14 was eagerly awaited by an attentive audience, keen to share his vision. From his comments, it was clear that 2022 will be an interesting year and does not appear particularly friendly for the PCB business.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/05/2022 | Nolan Johnson, I-Connect007
The Top 5 list this week contains industry analysis from IPC’s Shawn DuBravac, news on the passage of the U.S. “CHIPS Plus” bill, new materials from Ventec, news about a fab for sale, and a chemistry company completing their acquisition, plus a brand new book in the I-Connect007 eBooks series.



Copyright © 2022 I-Connect007. All rights reserved.