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Technic is pleased to announce the release of Ceramistan 1031, a pure tin electrolytic plating bath specially formulated for sensitive ceramic components, connectors, pins, and LED/MELF resistors. The Ceramistan 1031 process produces a dense, small grain deposit that provides excellent solderability, even after exposure to extended steam-age testing. The Ceramistan 1031 process offers several key cost-saving features including reduced coupling, longer bath life, and reduced oxidation.
Ceramistan 1031 also significantly reduces and can even eliminate spattering during reflow, a problem that often occurs with a standard tin bath. The process is compatible with all standard barrel and vibratory plating lines, and Technic’s patented Spouted Bed Electroplater (SBE®).
“Ceramistan 1031 has proven to be an ideal solution for applications requiring pure tin. The process performs extremely well in a full range of applications with consistent quality of the deposit and performance. With a longer bath life, reduced coupling, and reduced oxidation, Ceramistan 1031 has shown significant improvements to the quality, cost, and performance in pure tin plating for electronic applications,” says Eric Smith, R&D Chemist, Technic Advanced Technology Division.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
Pete Starkey, I-Connect007
Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.
I-Connect007 Editorial Team
"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."