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The electronics manufacturing industry is applauding the U.S. Senate for taking bipartisan action on legislation that will, if enacted, spur a new era of innovation, manufacturing and investment within the electronics industry.
The “CHIPS+” legislation, includes more than $52 billion funding to implement the CHIPS Act; at least $2.5 billion for advanced packaging R&D; as well as additional measures to boost American R&D. The measure passed in a bipartisan vote, 64-33.
“This legislation is the first step in strengthening a critical part of the U.S. electronics supply chain,” said IPC President and CEO John Mitchell. “Today's vote demonstrates that a robust and innovative electronics manufacturing industry is a strategic priority for the United States.
“With the August recess looming, the House must take action now and pass this legislation without delay,” Mitchell continued. “We also urge the Biden administration and Congress to remain committed to continue the work of bolstering the entire electronics ecosystem to ensure innovative, resilient, and secure electronics manufacturing. Chips do not function on their own.”
IPC is the industry’s leading advocate for building U.S. advanced packaging capabilities. IPC studies have urged Congress to couple its investments in semiconductor manufacturing with additional support for advanced packaging, printed circuit boards (PCBs), and related technologies. Without such action, U.S.-made chips will continue to be sent offshore to be manufactured into finished products, leaving the United States vulnerable to supply chain shocks.